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MDD SK1045C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD SK1045C
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- SK1045C
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.335g
- Electronic Component
- 1
- Electronic Component
- BM0229465233
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 1mA@45V
- (Vf)
- 650mV@10A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK1045C 产品概述
一、产品简介
SK1045C 为 MDD 出品的一款高电流肖特基整流二极管，封装为 SMC (DO‑214AB)。器件在10A工作电流下正向压降典型为0.65V，反向耐压为45V，适用于低压大电流场合的整流与续流保护。
二、主要特性
- 肖特基结构，导通压降低，开关速度快；
- 正向压降：650mV @ 10A（典型值）；
- 连续整流电流：10A；
- 直流反向耐压（Vr）：45V；
- 反向漏电流：1mA @ 45V（需注意随温度上升而增加）；
- 非重复峰值浪涌电流（Ifsm）：150A（用于吸收瞬态冲击或开机涌流）；
- 工作结温范围：-55℃ ～ +150℃。
三、电气与热设计要点
在额定工作点10A、Vf约0.65V时，器件耗散功率约为P = Vf × I = 6.5W。实际系统设计必须考虑热阻与散热路径，保证结温低于最大允许值。反向漏流随温度显著增加，在高温或反向电压靠近45V时应评估漏流对系统的影响并采取降额设计。
四、典型应用
- 开关电源（整流、输出续流二极管）；
- DC‑DC 转换器与功率模块；
- 电机驱动续流保护；
- 电池充放电与逆变器保护；
- 反向保护与低压大电流整流场合。
五、封装与安装建议
SMC (DO‑214AB) 封装适合贴片焊接，需在 PCB 设计中提供足够的铜箔面积和热过孔以降低结温。建议：
- 在焊盘下方与背部用大面积铜箔和通孔散热；
- 对于长期10A工作电流应评估并加装散热片或提高 PCB 铜厚；
- 遵循制造商焊接曲线，避免超过推荐回流温度及时间；
- 在高频开关场景注意布局以减小寄生电感。
六、可靠性与使用注意
- 反向耐压为45V，切勿在接近或超过额定 Vr 的条件下长期工作；
- 浪涌能力为150A，可承受短时冲击，但多次重复冲击或高能量冲击需额外保护；
- 环境温度较高时应进行降额使用，防止结温超限导致漏流增加或寿命下降；
- 盘装或散装时注意静电与机械应力保护。
七、选型参考与替代
SK1045C 适合低压（≤45V）、高电流（≈10A）场景。如需更高耐压或更低漏电，可考虑其他耐压等级或低漏型肖特基器件。具体选型与订购请参照 MDD 官方资料与样片测试结果。
以上为 SK1045C 的主要性能与工程应用要点，详细电气特性曲线、热阻数据及封装尺寸请以 MDD 官方数据手册为准，并在设计中按照数据手册的热仿真与测试结果进行最终确认。
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