WMSIC Electronic Components

MDD MMSZ5243B

ModelMMSZ5243B
PackageSOD-123
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

13 specifications

Core information

Product name
MDD MMSZ5243B
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
MMSZ5243B
Electronic Component
1
Package
SOD-123
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0265980100
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MMSZ5243B稳压二极管产品概述

一、核心身份与封装特征

MMSZ5243B是MDD品牌推出的表面贴装稳压二极管,属于MMSZ52系列13V稳压规格,专为小型化、低功耗电路设计。其采用SOD-123封装,尺寸约为2.9mm×1.6mm×1.0mm(典型值),适配0805/1206焊盘,可直接用于高密度PCB布局,广泛兼容消费电子、工业控制等领域的小型设备。

二、关键电气参数详解

该器件的电气性能经标准化测试,核心指标及实际意义如下:

  1. 稳压值(标称/范围):标称稳压值13V,实际产品稳压范围为12.35V~13.65V。此范围由生产工艺公差决定,可满足大部分13V基准需求,无需额外校准即可实现基本稳压。
  2. 反向漏电流(Ir):500nA(标准测试条件:反向电压10V)。小漏电流意味着反向截止状态下功耗极低,适合电池供电的便携式设备,可减少待机损耗。
  3. 最大耗散功率(Pd):500mW。这是器件允许的最大功率损耗,实际应用需注意:Pd = (输入电压V_in - 稳压值Vz) × 工作电流Iz,建议最大工作电流不超过38mA(500mW/13V≈38.5mA),避免过热损坏。
  4. 动态阻抗(Zzt):13Ω(典型值,测试电流5mA)。反映稳压管在工作点附近的电压稳定性,数值越小则电压随电流波动越小,稳压精度越高;反向击穿前阻抗Zzk为600Ω,可抑制低电压下的电流波动。

三、典型应用场景

结合参数特点,MMSZ5243B的核心应用场景包括:

  1. 小型直流电源稳压:用于15V~24V输入到13V的稳压转换,例如单片机核心板辅助电源、传感器模块供电,满足低功耗、小体积需求。
  2. 过压保护电路:当电路电压意外超13V时,稳压管反向击穿导通,将电压钳位在13V左右,保护后级敏感器件(如MCU、ADC),常见于工业PLC、消费电子充电电路。
  3. 低功耗基准电压源:在电池供电设备中,作为简单基准给12位ADC提供参考,因500nA漏电流不会显著增加系统功耗。
  4. 电平转换电路:配合电阻实现5V到13V的电平转换,适配不同电压域器件的SPI/I2C通信接口。

四、性能优势与使用注意事项

性能优势

  • 低功耗适配:500nA漏电流+500mW功耗,适合电池供电设备;
  • 稳压一致性好:12.35V~13.65V范围较窄,批量应用无需频繁调试;
  • 小体积高密度:SOD-123封装节省PCB空间,适配小型化产品;
  • 稳压精度高:13Ω动态阻抗确保负载变化时电压波动小,满足精密电路需求。

使用注意事项

  1. 功耗限制:严格控制工作电流≤38mA,避免超500mW耗散功率;
  2. 焊接规范:回流焊温度≤260℃(持续≤10s),波峰焊温度≤240℃(持续≤5s),防止封装变形;
  3. 静电防护:对ESD敏感,生产/测试需佩戴防静电手环,使用防静电包装;
  4. 环境温度:工作范围-55℃~150℃,避免极端高温长期工作。

五、选型补充参考

若需调整参数,可参考同系列或替代型号:

  • 更高稳压值:MMSZ5244B(15V,500mW)、MMSZ5245B(16V,500mW);
  • 更大耗散功率:1N4744A(15V,1W)、1N4745A(16V,1W);
  • 更小封装:MMSZ5243B(SOD-323封装,300mW)。

该器件凭借小体积、低功耗、稳定稳压的特点,成为小型电子设备稳压/保护电路的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.