WMSIC Electronic Components

MDD BZT52C30S

ModelBZT52C30S
PackageSOD-323
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD BZT52C30S
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
BZT52C30S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
80Ω
Electronic Component
BM0264866552
Diode
1
Current(Ir)
100nA@23V
Power Dissipation(Pd)
200mW
Electronic Component
28V~32V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C30S稳压二极管产品概述

一、产品基本定位

BZT52C30S是一款独立式稳压二极管(齐纳二极管),由国内知名半导体厂商MDD出品,采用SOD-323表面贴装小型封装,核心功能为提供稳定的30V基准电压,适用于对体积、功耗有严格要求的小型电子电路,可覆盖消费电子、工业辅助电路等多场景应用。

二、核心电性能参数详解

该器件的关键电性能参数均经过严格校准,具体如下:

  • 稳压值标称与范围:标称稳压值30V,实际稳压范围28V~32V(偏差±3.3%),满足一般电路对电压稳定的基础需求;
  • 反向漏电流:在23V反向偏置下,漏电流仅100nA,远低于常规稳压管的漏电流指标,可有效降低静态功耗;
  • 耗散功率:最大允许耗散功率200mW(0.2W),需配合限流电阻使用以避免过功率损坏;
  • 动态阻抗:稳压工作状态下动态阻抗Zzt为80Ω,反映了稳压值随电流变化的稳定性,属于该封装级别器件的合理性能区间;
  • 反向击穿特性:反向击穿电压与稳压值匹配,击穿过程稳定,无明显“软击穿”现象。

三、封装与物理特性

BZT52C30S采用SOD-323封装,是目前小型表面贴装器件的主流封装之一,具有以下特点:

  • 尺寸紧凑:标准尺寸约1.6mm(长)×0.8mm(宽)×0.6mm(高),适合高密度PCB布局,可有效缩小电路体积;
  • 环保无铅:符合RoHS 2.0、REACH等国际环保标准,采用无铅焊端,兼容回流焊、波峰焊等自动化焊接工艺;
  • 引脚设计:2引脚封装,极性清晰(通常带色环端为阴极),焊接兼容性好,不易出现虚焊问题。

四、典型应用场景

基于其小体积、低功耗、稳定稳压的特性,BZT52C30S广泛应用于以下场景:

  1. 小型电子设备电源稳压:如便携式传感器、蓝牙耳机、智能手环等低功耗设备的辅助电源电路,为敏感元件提供稳定电压;
  2. 电压基准参考:替代复杂的集成基准源,用于简单电路的电压校准(如简易电压表、信号发生器的基准);
  3. 过压保护电路:与限流电阻串联,当输入电压超过稳压值时,器件反向击穿导通,限制后级电路电压,防止过压损坏;
  4. 传感器信号调理:稳定温度传感器、压力传感器的供电电压,减少电压波动对信号精度的影响;
  5. 消费电子辅助电路:如遥控器、LED小夜灯、小型充电器的稳压模块,平衡成本与性能需求。

五、选型与使用注意事项

为确保器件稳定工作,需注意以下要点:

  1. 限流电阻计算:实际工作电流需控制在最大允许值以内(Izmax=Pd/Vz=200mW/30V≈6.67mA),串联限流电阻计算公式为:( R=(V_{in}-V_z)/I_z )(( V_{in} )为输入电压,( V_z )为稳压值,( I_z )为工作电流,需小于Izmax);
  2. 焊接温度控制:SOD-323封装对焊接温度敏感,回流焊峰值温度不超过260℃,焊接时间不超过10秒,避免热损伤;
  3. 静电防护:器件为静电敏感元件,存储、运输、焊接过程中需采用ESD防护措施(如防静电袋、接地工作台);
  4. 温度影响:稳压值随温度略有变化,若对精度要求较高,可配合温度补偿电路优化;
  5. 反向电压限制:工作时反向偏置电压不得超过稳压范围上限(32V),避免长时间过压导致器件性能下降。

六、品牌与可靠性说明

MDD作为国内专注于分立器件研发生产的厂商,其产品通过ISO9001质量管理体系认证,BZT52C30S经过以下可靠性试验验证:

  • 高低温循环测试(-55℃~125℃,1000次循环);
  • 湿度测试(85℃/85%RH,1000小时);
  • 机械振动测试(20Hz~2000Hz,加速度2g);
  • 电性能老化测试(24小时连续工作)。

产品符合工业级与消费级应用的可靠性要求,可满足多数小型电路的长期稳定运行需求。

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