WMSIC Electronic Components

MDD MSB30M

ModelMSB30M
PackageMSB
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD MSB30M
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
MSB30M
Electronic Component
1
Package
MSB
Type
Electronic Component
Electronic Component
Bridge Rectifier
Electronic Component
0.582g
Electronic Component
1
Electronic Component
BM0227798513
Current
3A
Current(Ir)
5uA@1kV
(Vf)
1.1V@3A
Electronic Component
55℃~+150℃@(Tj)
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSB30M 产品概述

1. 产品简介

MSB30M 是一款高性能整流桥,由知名品牌 MDD 生产,采用 UMSB 封装。该产品广泛应用于各种电源转换和整流电路中,具有高效、稳定和耐用的特点。MSB30M 的设计旨在满足高电压和高电流的应用需求,适用于工业、消费电子和汽车电子等领域。

2. 主要参数

  • 反向电流 (Ir): 5µA @ 1kV
  • 整流电流: 3A
  • 正向压降 (Vf): 1.1V @ 3A
  • 正向浪涌电流 (Ifsm): 80A
  • 直流反向耐压 (Vr): 1kV
  • 工作温度范围: -55℃ ~ +150℃ @ (Tj)

3. 产品特点

  • 高效整流: MSB30M 具有低正向压降 (1.1V @ 3A),能够有效减少能量损耗,提高整体效率。
  • 高耐压能力: 直流反向耐压高达 1kV,确保在高压环境下稳定工作。
  • 低反向电流: 反向电流仅为 5µA @ 1kV,减少漏电流,提高系统可靠性。
  • 宽温度范围: 工作温度范围为 -55℃ ~ +150℃,适应各种恶劣环境。
  • 高浪涌电流: 正向浪涌电流可达 80A,能够承受瞬间大电流冲击,保护电路安全。

4. 应用领域

MSB30M 适用于多种电源和整流应用,包括但不限于:

  • 工业电源: 用于工业设备的电源转换和整流,确保设备稳定运行。
  • 消费电子: 适用于家用电器、充电器等消费电子产品,提供高效整流功能。
  • 汽车电子: 用于汽车电源管理系统,满足汽车电子对高可靠性和高耐压的要求。
  • 通信设备: 用于通信设备的电源模块,确保设备在高压环境下稳定工作。

5. 封装与尺寸

MSB30M 采用 UMSB 封装,具有紧凑的尺寸和良好的散热性能,便于在各种电路板上安装和使用。具体封装尺寸如下:

  • 封装类型: UMSB
  • 尺寸: [具体尺寸待补充]

6. 品牌与质量保证

MSB30M 由 MDD 品牌生产,MDD 作为全球知名的电子元器件制造商,以其高质量和可靠性著称。MDD 的产品经过严格的质量控制和测试,确保每一颗 MSB30M 都能满足客户的需求。

7. 总结

MSB30M 是一款高性能、高可靠性的整流桥,适用于多种电源和整流应用。其低正向压降、高耐压能力和宽温度范围使其成为各种电子设备的理想选择。无论是工业、消费电子还是汽车电子,MSB30M 都能提供稳定、高效的整流解决方案。选择 MSB30M,您将获得 MDD 品牌的高质量保证和卓越的性能体验。

如需更多技术细节或定制化服务,请联系 MDD 官方技术支持团队。

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Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

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