WMSIC Electronic Components

MDD DHE1M

ModelDHE1M
PackageSOD123FL
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD DHE1M
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
DHE1M
Electronic Component
1
Package
SOD123FL
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.039g
Electronic Component
1
Electronic Component
BM0227798514
Current
1A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.7V@2A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

超快恢复二极管 DHE1M U1M — 产品概述

一、产品简介

DHE1M(又标注为 U1M)是 MDD 推出的超快恢复二极管,面向高压、高速开关应用设计。器件采用 SOD123FL 低轮廓封装,结合较快的反向恢复特性,适合开关电源、逆变器和高压整流等场合作为整流或续流元件使用。

二、主要电气参数

  • 正向压降(Vf):典型 1.7 V @ 2 A(实际使用请参考器件曲线和工作电流区间)
  • 直流反向耐压(Vr):1000 V(1 kV)
  • 平均整流电流:1 A(I(AV))
  • 反向电流(Ir):5 μA @ 1 kV
  • 反向恢复时间(Trr):75 ns(超快恢复等级)
  • 工作结温范围(Tj):-55 ℃ ~ +125 ℃

以上参数反映了器件在高压环境下的低泄漏特性与快速开关响应,适用于高压、高频率的整流与续流场景。

三、封装与热管理

SOD123FL 封装体积小、引脚短,适用于自动贴装与高密度电路板。由于封装限制,器件散热能力有限,使用时应注意:

  • 平均整流电流按 1 A 设计并做适当余量;若电路存在脉冲或浪涌电流,需核对数据手册中脉冲峰值能力并做好热仿真。
  • 在 PCB 设计上增大焊盘面积并连接铜厚的散热层,有助于降低结温并提高可靠性。
  • 在高结温或高频切换时,对正向压降和反向恢复特性做温度依赖考量。

四、典型应用场景

  • 开关电源(SMPS)的次级整流或主回路续流二极管
  • 高频逆变器与电机驱动中的整流与反向保护
  • 功率因数校正(PFC)电路的高压整流单元(依据电流等级)
  • 高压脉冲或电荷泵电路中的快速恢复整流

五、选型与使用建议

  • 若工作电流长期接近或超过 1 A,应选择额定电流更高的器件或并联多只并合理考虑热平衡。
  • 超快速恢复(Trr ≈ 75 ns)有助于降低开关损耗和峰值应力,但在某些场合可能引起高频尖峰,建议配合适当的缓冲网络(RC、阻尼)或开关栅极优化来抑制振铃。
  • 反向泄漏仅 5 μA @1 kV,适合高压整流;但在高温条件下泄漏会升高,应在热设计中预留裕量。
  • 如需更低正向压降或更快恢复,比较肖特基或更高速恢复器件的特性以确定最优方案。

六、储存与可靠性注意事项

  • 器件工作结温上限为 +125 ℃,设计时应保证实际结温低于该值并满足寿命退化要求。
  • 建议遵循常规无铅回流焊温度曲线与厂家推荐的焊接工艺,避免长时间高温烘烤以免影响封装和性能。
  • 受潮防护:若采用湿敏等级(MSL)管理的包装,开封后依规定时间回流焊。

总结:DHE1M(U1M)以 1 kV 的高耐压、1 A 的整流能力与 75 ns 的超快恢复时间,适合高压高频的整流与续流应用。实际电路设计应综合考虑结温、脉冲电流能力与滤波/抑振措施,必要时参考完整数据手册以确认峰值与脉冲参数。

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