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MDD RS1MF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD RS1MF
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- RS1MF
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.056g
- Electronic Component
- 1
- Electronic Component
- BM0226436791
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 1.3V@1A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RS1MF 产品概述
RS1MF 是 MDD 推出的一款快恢复、高效率高压整流二极管，采用 SMAF 表面贴装封装，面向需要高耐压与快速恢复特性的开关电源和高压整流应用。器件在 1A 连续整流电流条件下，正向压降 Vf 为 1.3V（@1A），具有 1kV 的直流反向耐压和较低的反向漏电流，兼顾高压可靠性与开关效率。
一、主要参数与特点
- 二极管配置：独立式（单只二极管）
- 封装：SMAF（适合表面贴装，易于自动化贴装与回流焊）
- 正向压降：Vf = 1.3V @ IF = 1A
- 额定整流电流：IF(AV) = 1A
- 非重复峰值浪涌电流：Ifsm = 30A（单次半正弦，短时浪涌能力）
- 直流反向耐压：Vr = 1000V
- 反向电流：Ir = 5µA @ Vr = 1kV
- 反向恢复时间：Trr = 500ns（快恢复特性，有利于减少开关损耗）
- 工作结温范围：Tj = -55℃ ~ +150℃
二、性能亮点
- 高耐压低漏电：1kV 反向耐压并在满压下仅 5µA 的漏电，适合高压整流与隔离型电源二次侧或一次侧高压回路。
- 快恢复：500ns 的反向恢复时间能有效降低开关损耗和开关干扰，适合中高频开关电源与 PFC 电路。
- 良好浪涌承受：30A 单次浪涌能力，能在电源启动或短时过载情形下提供保护余量。
- 小型封装：SMAF 占板面积小、热阻相对可控，适合空间受限的设计。
三、典型应用场景
- 开关电源（SMPS）高压整流与续流二极管
- 功率因数校正（PFC）整流桥或高压整流器
- 反向保护与高压隔离电路
- 工业电源、通信基站电源及家电中的高压整流模块
四、热设计与使用建议
- 虽然器件额定整流电流为 1A，但实际连续工作电流受 PCB 铜箔散热、环境温度以及封装热阻影响。建议在高环境温度下进行适当降额（例如在 >60℃ 时考虑 70% 以下额定电流）。
- 优化焊盘与加大散热铜箔面积可显著改善热性能；在设计中为器件提供良好热回流路径。
- 浪涌条件下 Ifsm 为单次峰值，避免频繁在该条件下工作以延长寿命。
五、安装与可靠性注意事项
- 采用标准回流焊工艺，遵循封装推荐的温度曲线以避免热应力损伤。
- 存储与使用环境避免潮湿和腐蚀性气体，推荐按电子元件储存规范防潮防静电。
- 在高压应用中布局需注意爬电距离和绝缘，确保满足安全规范要求。
六、选型与订购信息
- 型号：RS1MF
- 品牌：MDD
- 封装：SMAF
- 适合替代场景：需 1kV 级别耐压且要求较快恢复的整流二极管设计。
如需更详细的参数表（如最大结至焊盘热阻、典型 Vf 曲线与 Ir 随温度变化曲线、封装引脚尺寸图），建议索取 MDD 官方数据手册以便进行电路仿真与可靠性评估。
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