Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD MDD7N65D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD MDD7N65D
- Type
- MDD
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- MDD7N65D
- Electronic Component
- 1
- Package
- TO-252
- Electronic Component
- 1 N
- Electronic Component
- MOSFET
- Electronic Component
- 0.47g
- Electronic Component
- 1
- Electronic Component
- BM0264463819
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 100W
- Electronic Component
- Electronic Component
- Electronic Component
- 2500
- Voltage(Vdss)
- 650V
- Capacitor(Ciss)
- 1.09nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MDD7N65D 产品概述
一、产品简介
MDD7N65D 是一款高压 N 沟增强型功率 MOSFET，适用于中等功率开关和保护电路。器件耐压达 650V，设计用于承担高压开关场合的漏源电压要求，封装为 TO-252（DPAK），便于表面贴装与散热处理。品牌：MDD。
二、主要电气参数
- 漏源电压 Vdss：650 V
- 连续漏极电流 Id：7 A（热阻与散热条件相关）
- 导通电阻 RDS(on)：1.4 Ω @ VGS = 10 V
- 耗散功率 Pd：100 W（视封装与 PCB 散热设计）
- 栅阈电压 Vgs(th)：约 2 V（静态阈值，导通需更高栅压）
- 总栅电荷 Qg：20.7 nC @ VGS = 10 V（驱动能量参考）
- 输入电容 Ciss：1.09 nF
- 反向传输电容 Crss：6.1 pF
- 工作结温范围：-55 ℃ ~ +150 ℃
三、封装与热特性
TO-252（DPAK）表面贴装封装适合中等功率密度 PCB 设计。标称 Pd 可达 100 W，但实际使用中需结合 PCB 铜箔面积、底部散热垫、过孔散热以及环境温度来确定允许的连续电流与功耗。建议在高耗散场合配合散热片或加大 PCB 热铜层以保证结温在安全范围内。
四、典型应用
- 开关电源中的高压开关管（次级侧或高压初级侧）
- 功率因数校正（PFC）和续流/阻断电路（视具体电路要求）
- 断路保护、过压/过流检测与继电器替代方案
- 中小功率逆变与电机驱动辅助电路
五、设计与使用建议
- 驱动电压：器件在 VGS = 10 V 时 RDS(on) 标称值，可采用 10–12 V 的栅极驱动电压以获得较低导通损耗；若采用逻辑电平驱动，应评估 RDS(on) 的增加对损耗的影响。
- 驱动能力：Qg = 20.7 nC，栅极驱动器需具备足够电流能力以实现期望的开关速度，避免开关损耗增加。
- 开关速率：Ciss 及 Crss 值显示本器件适中开关速度，Crss 较小对降低米勒效应有利，适合高压快速开关场合。
- 热管理：在高电流或高占空比应用中，通过增加 PCB 散热铜箔、使用过孔与外接散热片来降低结温。
- 并联注意：若需并联以增大电流，建议在源极处使用小阻值匹配电阻并保证热均匀性，注意散热一致性和开关同步性。
六、封装焊接与可靠性注意事项
- TO-252 为表贴封装，推荐遵循厂家回流焊温度曲线进行焊接，避免长时间高温导致封装热应力。
- 出于 ESD 防护，存储与操作时请采取静电防护措施（腕带、离子风机、导电包装）。
- 在高压应用中注意爬电距离与绝缘处理，保证安全与可靠性。
七、总结
MDD7N65D 以 650V 高耐压特性、适中的导通电阻和中等栅电荷量，适合需要高压耐受且体积受限的开关场合。设计时应重点考虑栅极驱动能力与散热设计，以发挥器件在导通损耗与开关损耗之间的最佳平衡。若需替换或并联使用，请参考完整数据手册并进行热与动态匹配验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
