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MDD TTR5MF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD TTR5MF
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- TTR5MF
- Electronic Component
- 1
- Package
- TTF
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.561g
- Electronic Component
- 1
- Electronic Component
- BM0258755381
- Current
- 5A
- Current(Ir)
- 5uA@1kV
- (Vf)
- 1.1V@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TTR5MF（MDD）——5A/1kV 单相整流桥产品概述
一、产品概述
TTR5MF 是 MDD 推出的高压单相整流桥，额定整流电流为 5A，单个器件即可完成交流到直流的整流功能。器件在 5A 工作点的典型正向压降为 1.1V（Vf @ 5A），直流反向耐压达到 1kV（Vr），在高压应用中具有良好的阻断能力和稳定的直流输出特性。封装为 TTF，适合标准电路板安装并利于散热设计。
二、主要电气参数
- 额定整流电流：5A（连续）
- 正向压降：1.1V @ 5A（典型）
- 直流反向耐压：1kV（Vr）
- 反向漏电流：≤5μA @ 1kV（Ir）
- 非重复峰值浪涌电流：180A（Ifsm，典型按半波浪涌测量）
- 工作结温范围：-55℃ ~ +150℃
- 类型：单相整流桥（桥堆）
三、关键优势
- 高压阻断性能良好：1kV 的耐压使其适用于高压整流与隔离输入场合。
- 低正向压降：1.1V @5A 有助于降低整流损耗和发热，提高效率。
- 低反向漏流：5μA @1kV 在高压系统中能有效降低静态功耗与热耗散。
- 强浪涌承受能力：180A 的单次浪涌容忍能力可应对启动或短时冲击电流。
- 宽温度范围：适应工业级和严苛环境的热稳定性。
四、典型应用场景
- 高压整流电源（如 HV DC supply）
- 开关电源的输入整流与预整流器
- 工业电源、充电设备与电机驱动的高压输入端
- LED 驱动及高压照明电源
- 安防、电力电子和逆变器的整流前端
五、设计与热管理建议
- 热管理：尽管 Vf 较低，但在 5A 连续工作下仍需良好散热，建议在 PCB 上提供充足铜箔、热过孔或金属散热片以降低结温并延长寿命。
- 浪涌保护：配合合适的慢熔断器或压敏电阻（MOV）以缓解偶发浪涌和浪涌功率应力。
- 降额运行：在高环境温度或连续高负载场合考虑电流降额，以控制结温在安全范围内。
- EMI 与滤波：整流后端并联合适电容与滤波网络，以控制纹波和抑制开关噪声。
六、可靠性与使用注意
- 反向漏流随温度快速上升，高温环境下应重点评估漏流对系统的影响。
- 非重复浪涌 Ifsm 为短时承受能力，反复冲击会加速器件老化，设计时应避免频繁超过额定浪涌。
- 储存与焊接按通用半导体规范执行，避免高温湿度和机械应力对封装产生影响。
七、封装与采购建议
- 封装：TTF，适合常规安装工艺，便于手工或自动化装配并利于热传导。
- 选型建议：在选用时核对实际工作电压、最大瞬态冲击、环境温度与散热条件；若系统存在更高浪涌或更低漏流需求，可考虑更高规格或特殊工艺器件。
- 品牌与支持：MDD 提供的 TTR5MF 适合需要高压、5A 连续整流且要求可靠性的工业与电源类设计。
如需进一步的电气特性曲线（Vf–I、Ir–Vr–T、热阻θJA/θJC）或封装引脚图与推荐 PCB 尺寸，请提供需求，我可以基于器件典型规范给出更详尽的设计资料与布板建议。
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