WMSIC Electronic Components

MDD BZT52C12S

ModelBZT52C12S
PackageSOD-323
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD BZT52C12S
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
BZT52C12S
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
35Ω
Electronic Component
BM0264463835
Diode
1
Current(Ir)
100nA@9V
Power Dissipation(Pd)
200mW
Electronic Component
11.4V~12.7V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C12S稳压二极管产品概述

一、产品基本属性

BZT52C12S是MDD品牌推出的独立式稳压二极管,型号命名中“BZT52”代表其属于稳压二极管系列,“C12”明确标称稳压值为12V,封装形式为SOD-323(超小型表面贴装封装)。该器件无需与其他元件配对,独立封装即可实现稳压功能,安装、维护灵活,适合各类小型化电子设备的电压稳定需求。

二、核心电气参数解析

  1. 稳压值范围:标称稳压值12V,实际工作稳压范围为11.4V~12.7V,覆盖了常见12V级稳压场景,满足不同工况下的电压稳定要求;
  2. 反向漏电流:反向电压9V时,反向电流仅100nA,属于低漏电流设计,可有效降低静态功耗,尤其适合电池供电的便携式设备;
  3. 额定耗散功率:最大耗散功率200mW,能稳定承载小功率电路的稳压任务,实际应用中需避免功率过载;
  4. 动态阻抗:稳压时动态阻抗35Ω,动态阻抗越低,输出电压受负载变化的影响越小,稳压精度更稳定。

三、封装与物理特性

BZT52C12S采用SOD-323封装,这是一种超小型表面贴装封装,典型尺寸约0.8mm×0.6mm,可显著节省电路板空间,适配高密度PCB设计。封装兼容自动化贴装工艺,生产效率高;同时具备良好的散热性能,能有效分散工作热量,保障器件长期稳定运行。

四、性能优势总结

  1. 低功耗适配:100nA的低反向漏电流,大幅减少静态电流消耗,特别适合智能手环、蓝牙耳机等对功耗敏感的设备;
  2. 稳压精度稳定:11.4V~12.7V的稳压范围与35Ω的低动态阻抗,使输出电压波动极小,可为后级电路提供可靠参考电压;
  3. 小型化设计:SOD-323封装体积紧凑,满足便携式电子、小型电源模块等对空间要求严格的场景;
  4. 独立式配置:无需配对使用,安装灵活,降低了电路设计与生产的复杂度。

五、典型应用场景

BZT52C12S的特性使其适用于以下场景:

  1. 便携式电子设备:如智能手机、智能手表、蓝牙耳机的电源稳压电路,提供稳定12V基准电压;
  2. 微控制器参考电压:为MCU、传感器等提供稳定工作电压参考,保障信号采集与处理准确性;
  3. 小型电源模块:在5V/9V输入的小功率电源中,配合限流电阻实现12V稳压输出;
  4. 电压钳位保护:作为过压保护元件,防止后级器件因电压过高损坏(如电池充电电路、信号接口电路)。

六、选型与使用注意事项

  1. 功率限制:实际应用需确保耗散功率不超过200mW,可通过串联限流电阻控制电流(公式:(R_{限流} \geq \frac{V_{输入}-V_{稳压}}{I_{最大负载}+I_{稳压管}}));
  2. 反向电压:避免反向电压超过稳压值(12V),防止器件击穿损坏;
  3. 环境温度:工作温度需在器件允许范围内(通常-55℃~150℃,需参考具体datasheet),高温环境下需注意散热;
  4. 贴装工艺:SOD-323封装体积小,需注意贴装精度,避免虚焊或短路。

该器件综合性能平衡,是小功率稳压、参考电压、过压保护等场景的实用选择,尤其适合对空间和功耗敏感的电子设备设计。

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