WMSIC Electronic Components

MDD SM36

ModelSM36
PackageSOT-23
BrandMDD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MDD SM36
Type
MDD
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MDD
Electronic Component
SM36
Electronic Component
1
Package
SOT-23
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.028g
Electronic Component
1
Cj- Capacitor
1pF
Electronic Component
BM0264463832
Operating Temperature
55℃~+150℃
Voltage
75V
Electronic Component
IEC 61000-4-2;IEC 61000-4-4
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SM36 ESD 二极管(SOT-23)产品概述

一、产品简介

SM36 是 MDD 推出的双向 ESD 二极管,采用 SOT-23 小封装,专为高可靠性瞬态浪涌和静电放电保护设计。器件在正常工作电压下为高阻态,遇到过压事件时迅速导通,将冲击能量钳位到安全电平,保护后端敏感元件免受破坏。工作温度范围宽(-55℃ 至 +150℃),适合工业级和消费级产品的静电与脉冲抗扰需求。

二、主要参数

  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:36 V
  • 击穿电压 VBR:40 V
  • 钳位电压(典型):75 V
  • 峰值脉冲电流 Ipp:5 A
  • 峰值脉冲功率 Ppp:350 W
  • 反向漏电流 Ir:1 μA
  • 结电容 Cj:1 pF(适合高速信号线)
  • 工作温度:-55℃ ~ +150℃
  • 防护规范:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)
  • 类型:ESD 抑制器
  • 封装:SOT-23

三、关键特性与优势

  • 双向保护:可同时应对正负极性瞬态,适用于差分信号或无法明确极性的接口。
  • 低结电容:1 pF 的典型值对高速数据信号干扰极小,适合 USB、HDMI、LVDS、通信接口等。
  • 高能量吸收能力:5 A 峰值脉冲电流与 350 W 峰值功率,能处理常见的静电与快速瞬态脉冲。
  • 宽温度范围与工业级可靠性:适用于严苛环境,寿命和稳定性良好。
  • 小型封装:SOT-23 有利于 PCB 布局密集的设计。

四、典型应用场景

  • 接口保护:USB、RS-485、CAN、HDMI、I/O 引脚等。
  • 无线通信设备和射频前端的瞬态防护(注意匹配与插损)。
  • 工业控制模块、车载电子、消费电子等对 ESD/突发干扰敏感的系统。

五、封装与引脚说明

  • 封装:SOT-23(三针小封装),便于自动贴片与回流焊接。
  • 引脚功能:中间引脚通常接地或系统地;两侧引脚分别为保护端(双向对称),具体请参考产品原厂封装图与 PCB Footprint 建议。

六、设计与布局建议

  • 靠近受保护器件:将 SM36 尽可能靠近被保护的接口或芯片放置,以缩短走线电感,降低钳位电压。
  • 优先接地回路低阻抗:确保地平面连续且与 PCB 地层良好连接,以快速泄放能量。
  • 考虑串联阻抗/滤波:在对信号完整性有更高要求的场合,可结合小电感或 RC 滤波网络实现更优保护与匹配。
  • 回流焊工艺兼容,建议参考 MDD 的回流温度曲线与焊盘设计。

七、可靠性与规范确认

SM36 针对 IEC 61000-4-2 与 IEC 61000-4-4 有良好抗扰表现,但在最终产品认证时仍需与系统级测试(包括接地、线缆、外壳等)配合验证。器件在最大额定功率或电流条件下应遵循脉冲宽度和重复频率限制,以免超出热耗散能力。

八、选型与注意事项

  • 若应用为单向保护或工作电压显著低于 36 V,可考虑单向 TVS 型号以获得更低钳位。
  • 对于超高速或射频链路,请评估结电容对信号的影响并进行实测。
  • 在高能量或长期脉冲工况下,留意器件热管理与可能的退化。

总结:SM36 在小尺寸封装中提供了平衡的电压等级、低电容与较高能量吸收能力,适用于需要双向保护且对信号完整性敏感的接口保护场合。如需原理图参考、封装尺寸或样片信息,可向供应商获取详细数据手册与应用笔记。

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