Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD SK1045B
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD SK1045B
- Type
- MDD
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- SK1045B
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.224g
- Electronic Component
- 1
- Electronic Component
- BM0230596231
- Current
- 10A
- Diode
- Electronic Component
- Current(Ir)
- 1mA@45V
- (Vf)
- 550mV@10A
- Electronic Component
- 50℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK1045B肖特基二极管产品概述
一、产品定位与核心类别
SK1045B是一款独立式肖特基整流二极管，属于低压大电流型功率器件，专为中小功率电子设备的高效整流设计。其核心优势在于低正向压降带来的低损耗特性，同时具备宽温耐受、抗浪涌冲击能力，适配多场景应用需求。
二、核心电性能参数详解
SK1045B的关键电参数直接决定应用边界，具体如下：
- 正向压降（Vf）：额定电流下导通压降为550mV@10A——肖特基二极管典型低Vf特性，显著降低导通损耗，提升电源转换效率（以5V输出为例，效率超99%），减少设备发热；
- 直流反向耐压（Vr）：额定反向阻断电压为45V，满足低压直流环境下的反向隔离需求，适配多数消费类、车载电子的电源电压范围；
- 额定整流电流（If）：连续工作电流额定值为10A，可稳定承载中小功率电路的整流负载，避免过载损坏；
- 反向漏电流（Ir）：额定反向电压下漏电流为1mA@45V——数值处于同类器件优良水平，反向阻断特性稳定，减少待机功耗；
- 工作结温范围：结温耐受**-50℃~+125℃**，覆盖工业级、车载级高低温环境，适应极端工况；
- 非重复峰值浪涌电流（Ifsm）：单次最大耐受浪涌电流为150A，可抵御电路启动、负载突变等突发大电流冲击，提升设备可靠性。
三、封装与品牌信息
- 品牌：由MDD品牌出品，该品牌在功率二极管领域具备成熟制造工艺，器件一致性与长期可靠性有保障；
- 封装：采用SMB（DO-214AA） 表面贴装封装——体积紧凑（符合行业标准尺寸），适配自动化贴装产线，同时具备良好散热性能，可有效导出10A电流工作时的热量，避免结温过高。
四、典型应用场景
基于参数特性，SK1045B的典型应用场景包括：
- 开关电源适配器：笔记本电脑、智能手机等便携设备充电器的低压整流（5V/10A以内输出）；
- 车载电子系统：车载充电器、中控电源模块（宽温范围适配-40℃~+85℃车载环境）；
- 小型直流电源模块：工业控制、通信设备的辅助电源（10A以内负载）；
- LED驱动电路：低功率LED显示屏、照明驱动（低Vf减少驱动损耗，提升光效）；
- 消费类电子：机顶盒、路由器、智能家电的电源整流单元（小体积适配设备小型化需求）。
五、关键特性总结
SK1045B的核心竞争优势可归纳为：
- 低损耗：550mV@10A正向压降，导通效率高；
- 宽温耐候：-50℃~+125℃结温范围，适应极端环境；
- 抗冲击：150A浪涌电流耐受，抵御突发电流；
- 小体积：SMB封装，适配高密度贴装设计；
- 高可靠：1mA@45V反向漏电流，长期工作稳定性好。
该器件凭借平衡的性能与成本优势，成为中小功率整流场景的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
