Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD GBU610
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD GBU610
- Type
- MDD
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- GBU610
- Electronic Component
- 1
- Package
- GBU
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 4.106g
- Electronic Component
- 1
- Electronic Component
- BM0226603487
- Current
- 6A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1.1V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GBU610 产品概述
一、产品简介
GBU610 为单相桥式整流器，品牌 MDD，采用 GBU 封装，适用于中高压直流整流场合。器件设计用于将交流电整流为稳态直流，具有较低正向压降和较高耐压、耐冲击能力，适配工业电源与电机驱动等应用。
二、主要参数
- 直流反向耐压 Vr：1 kV
- 整流电流（平均）：6 A
- 正向压降 Vf：1.1 V @ 3 A
- 非重复峰值浪涌电流 Ifsm：150 A
- 反向电流 Ir：10 µA @ 1 kV
- 工作结温范围：-55 ℃ ～ +150 ℃
三、典型特性与优势
- 低正向压降，降低功耗和发热；
- 高耐压与低反向泄漏，适合 1 kV 级别整流；
- 强抗浪涌能力，能承受启动或短时过载冲击；
- 宽温度范围保证恶劣环境下可靠工作。
四、应用场景
适用于高压电源整流、工业控制电源、高压充电设备、电机驱动及电力电子模块的输入整流环节，以及需要高耐压与中等电流能力的场合。
五、封装与散热建议
GBU 封装为四引脚桥式结构（两端交流输入，正负输出）。连续 6 A 工作时建议采取良好散热措施：加装散热片或优化 PCB 铜箔散热、保证引脚焊接与热路径良好，以维持结温在额定范围内。
六、选型与注意事项
选择时确认工作电压裕量、最大瞬态冲击与环境温度。若有更高浪涌或更低正向压降需求，可考虑并联或使用更高规格器件；实际应用中需配合适当的输入滤波和浪涌抑制元件以提高系统可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
