Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD KBU810
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD KBU810
- Type
- MDD
- Minimum package
- 400
Technical parameters
- Electronic Component
- MDD
- Electronic Component
- KBU810
- Electronic Component
- 1
- Package
- KBU
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 6.8g
- Electronic Component
- 1
- Electronic Component
- BM0084410698
- Current
- 8A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1.1V@8A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- 400
- Voltage Rating (Vr)
- 1kV
- Surge Current (Ifsm)
- 300A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：KBU810 整流桥
一、产品简介
KBU810 是一种高性能的整流桥，专为电力电子应用设计。其具备1V的正向压降，允许最大负载电流达到8A，并具有高达1000V的反向耐压能力，适合各种高电压电源电路中使用。该整流桥采用了MDD品牌的先进技术，能够在高温和高电流的条件下稳定工作，广泛应用于电源适配器、电动机驱动、逆变器和其它相关的整流应用中。
二、技术规格
- 最大正向电流：8A
- 最大反向电压：1000V
- 正向压降：1V @ 8A
- 反向泄漏电流：10μA @ 1000V
- 封装类型：KBU
- 工作温度范围：通常为-40°C至+125°C（具体取决于使用环境及散热设计）
三、产品特点
高效能： KBU810的正向压降仅为1V，意味着在工作时能够有效减少功率损耗，提升能源利用率。这样的特点使得其在高功率环境下的表现尤为出色。
宽广的电压适应性： 其最高耐压值达到1000V，适用于高电压的应用，能够在恶劣的电气环境中稳定工作。
低反向泄漏电流： 高达1000V的反向短路时，反向泄漏电流仅为10μA，确保了在不导通状态下的电能损失最小化，有助于提高整体电路的效率。
优良的散热性能： KBU封装设计具有良好的热传播特性，能够有效散发工作中产生的热量，从而确保整流桥在高电流工作条件下的可靠性与稳定性。
简化电路设计： KBU810的双向整流特性，支持不需要过多的附加元器件，可以简化电路设计，提高工程师的设计效率。
四、应用场景
KBU810 整流桥被广泛用于以下应用：
- 开关电源：在高频开关电源中，KBU810能够高效整流，确保输出电压的稳定性。
- 电动机驱动：在电动机的反向或正向驱动电路中，参数的稳定性和持久性至关重要，KBU810是理想选择。
- 家电产品：比如洗衣机、冰箱及微波炉等，整流桥的使用确保了设备的正常运转与能效。
五、总结
KBU810 整流桥是MDD 旗下的一款高效整流器件，其兼具高电流承载能力与宽电压范围的特点，在电力电子行业中扮演着重要角色。通过优化反向泄漏电流与正向压降的设计，使其在现代电源应用中具备了高效率与高稳定性，能够满足严苛的工业标准和应用需求。对于希望在电力转换领域进行高效能设计的工程师而言，KBU810无疑是一个理想的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
