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MDD KBU1010
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD KBU1010
- Type
- MDD
- Minimum package
- 400 盒
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- KBU1010
- Electronic Component
- 1
- Package
- KBU
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 6.8g
- Electronic Component
- 1
- Electronic Component
- BM0211338254
- Current
- 10A
- Current(Ir)
- 10uA@1kV
- (Vf)
- 1V@6A
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
- Electronic Component
- 400
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KBU1010 产品概述
一、产品简介
KBU1010 是 MDD 品牌的单相桥式整流器，采用 KBU 封装，面向中高压整流应用。器件额定整流电流为 10A，直流反向耐压 Vr = 1kV，反向漏电流 Ir = 10µA（@1kV），非重复峰值浪涌电流 Ifsm = 240A，工作结温范围宽（-55°C ~ +150°C@Tj），适合对耐压和抗浪涌能力要求较高的电源、变频、工业控制及整流模块等场景。
二、主要特性
- 额定整流电流（Io）：10A 连续整流能力，适合中等功率应用。
- 高耐压：Vr = 1kV，可用于高压直流侧或高压整流场合。
- 低漏电：Ir = 10µA@1kV，适合对静态漏电要求较严格的系统。
- 低正向压降：Vf = 1V@6A，有利于降低功率损耗和温升。
- 强抗浪涌能力：Ifsm = 240A（非重复峰值），对启动浪涌与短时过载有良好承受力。
- 宽温度范围：-55°C~+150°C（Tj），满足工业级环境要求。
三、典型电气参数（用户关注）
- 正向压降 Vf：1V @ 6A（选择时应关注在额定电流或更高电流下的 Vf 变化，以评估实际功耗）。
- 直流反向耐压 Vr：1000V（最大反向电压）。
- 反向电流 Ir：10µA @ 1000V（常温），温度升高时 Ir 会增加。
- 非重复浪涌电流 Ifsm：240A（单次峰值，波形与持续时间依应用而定）。
- 连续整流电流 Io：10A（请配合散热条件使用以保证长期可靠性）。
四、热管理与可靠性建议
- 虽然器件额定 Tj 最大可达 150°C，但为了延长寿命与保证可靠运行，建议在设计时留出裕量，典型工作结温控制在 100°C 以下更为稳妥。
- 正向压降引起的功耗 P ≈ Vf × Io（随电流上升而增大），应根据预计最大电流计算并设计合适散热器或加大 PCB 铜箔面积。
- 高耐压应用中反向漏电随温度上升显著增加，关键电路应考虑温升对漏电和耐压裕度的影响。
- Ifsm 为非重复峰值，避免重复或长期在该范围内冲击；如存在频繁冲击需采取限流、电阻吸收或软启动等措施。
五、典型应用场景
- 工业电源整流与滤波模块
- 高压电源及 HVDC 实验装置的整流端
- 伺服驱动、变频器的整流桥部分（需注意浪涌与散热）
- UPS、充电设备及电源适配器等中高压整流需求场合
六、选型与使用注意事项
- 核对实际工作电流与 Vf、功耗关系，必要时预留电流裕量或并联器件（并联时注意电流均流问题）。
- 在高浪涌或频繁启动场合，评估 Ifsm 与实际浪涌能量是否匹配，必要时加装浪涌抑制元件。
- PCB 布局时保证良好散热路径，焊盘与接地铜箔加厚，必要时采用散热片固定。
- 对安全规范、隔离距离等有严格要求的系统，应结合整机设计满足相应规范。
如需完整电气/热参数、封装图或典型波形数据，建议参考厂家详细数据手册或索取样片进行实测验证。
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