Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MDD GBU406
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MDD GBU406
- Type
- MDD
- Minimum package
- 500 盒
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MDD
- Electronic Component
- GBU406
- Electronic Component
- 1
- Package
- GBU
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 4.106g
- Electronic Component
- 1
- Electronic Component
- BM0230596334
- Current
- 4A
- Current(Ir)
- 10uA@600V
- (Vf)
- 1.1V@4A
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GBU406 产品概述
一、主要参数
GBU406 是一款单相整流桥，适用于中等功率整流场合。关键电气参数如下：
- 直流反向耐压（Vr）：600 V
- 平均整流电流（Io）：4 A
- 正向压降（Vf）：约1.0 V@2 A，约1.1 V@4 A
- 反向漏电流（Ir）：10 μA@600 V
- 非重复峰值浪涌电流（Ifsm）：135 A
- 工作结温范围（Tj）：-55 ℃ ~ +150 ℃
- 封装：GBU 系列整流桥；品牌：MDD
二、封装与热特性
GBU 封装为整流桥常见塑封形式，便于直接焊接在印制板上或配合散热片使用。尽管平均整流电流为4 A，但在长期可靠工作时需关注封装散热条件：建议在高温或高负载工况下配合外部散热措施，并参考厂方热阻参数进行温升计算与功率散耗评估。
三、电气特性说明
- 正向压降决定整流损耗，1.0–1.1 V 的 Vf 在中高电流下会产生较明显的功率损耗，应在热设计中考虑。
- 600 V 的耐压适合多数工业与消费类电源、适配器及灯具驱动等场景。
- 10 μA 的反向漏电流表明在高压下漏电较小，有利于减少空载或待机损耗。
- 135 A 的浪涌能力允许器件承受短时间充电电容冲击或启动浪涌。
四、典型应用场景
适用于开关电源次级整流、线性电源桥整流、充电器、DC 电机驱动、LED 驱动电源及工业控制电源等需要 600 V 耐压和中等整流电流的场合。
五、选型与使用建议
- 若追求更低损耗，可考虑肖特基或更低 Vf 的整流方案；若需要更大电流能力，选择更高 Io 或并联多只器件并注意电流均流。
- 布局时保证良好散热路径，必要时加装散热片或风冷。
- 注意浪涌电流来源（如大电容充电），必要时加熔断器或限流器保护。
- 验证实际工作温度下的电流降额规则，确保结温不超过规格上限。
六、可靠性与环境适应
GBU406 的结温范围宽，适应性强。为延长寿命，应避免长期在高温、高湿或强振动环境中无保护运行，推荐按照应用场景做防护和热管理设计。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
