WMSIC Electronic Components

MPS MP8770CGQ-Z

ModelMP8770CGQ-Z
PackageQFN-16(3x3)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP8770CGQ-Z
Type
MPS
Minimum package
5000

Technical parameters

Electronic Component
MPS
Electronic Component
MP8770CGQ-Z
Electronic Component
1
Package
QFN-16(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.32g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227742145
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
3V~17V
Switching Frequency
700kHz
Electronic Component
Electronic Component
Output Voltage
600mV~17V
Output Current
8A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP8770CGQ‑Z 产品概述

MP8770CGQ‑Z 是 MPS(Monolithic Power Systems)推出的一款高集成度降压型开关稳压器,适用于对体积、效率与瞬态响应有较高要求的点对点电源应用。器件采用 16 引脚 Power QFN (3×3 mm) 封装,内置开关管和同步整流,支持宽输入电压范围与大电流输出,结合多种保护与控制特性,可实现紧凑可靠的电源解决方案。

一、核心规格概览

  • 功能类型:降压型(同步整流)
  • 输入电压范围:3V ~ 17V
  • 输出电压范围:可调 0.6V ~ 17V(外部分压设定)
  • 最大输出电流:8A(连续)
  • 开关频率:典型 700kHz
  • 静态电流(Iq):约 100μA(轻载节能)
  • 工作温度(结温):-40℃ ~ +125℃(TJ)
  • 开关管:内置(高集成度)
  • 输出通道数:单通道
  • 封装:QFN-16 (3×3 mm)(PowerVQFN)
  • 主要功能特性:可调软启动、过流保护(含打嗝限流)、工作状态指示、同步整流

二、产品特点与优势

  • 高度集成:内置功率开关与同步整流 MOSFET,减少外部器件数量,缩小整体解决方案尺寸。
  • 宽输入与输出范围:3V17V 输入与 0.6V17V 可调输出,适配多种电源母线和点对点降压需求。
  • 高开关频率:700kHz 运行允许使用更小的电感与电容,利于紧凑布局与快速瞬态响应。
  • 低静态电流:100μA 静态电流有利于低功耗与待机节能应用。
  • 可靠的保护机制:内置过流保护并采用打嗝限流策略,可在短路或过载时限制热应力并自动尝试恢复;软启动功能可控制启动浪涌电流,保护电源与负载。
  • 温度与热管理友好:3×3 mm QFN 封装带热沉垫,配合 PCB 散热设计可满足高达 8A 的持续输出需求。

三、典型应用场景

  • 通信与网络设备的点对点电源(如给 SoC、FPGA、网络处理器供电)
  • 工业控制与仪器的局部降压电源
  • 汽车电子(在满足车规条件的前提下)或电池供电系统中需从高压降至低压的场合
  • 高性能嵌入式系统、单板电脑及存储设备的核心/外设电源

四、设计与布局建议

  • 外部电感:选择额定电流高于 8A 的低 DCR、低饱和特性的功率电感。由于 700kHz 开关频率,可选体积更小的磁性元件以实现紧凑方案。
  • 输出电容:优先使用 X5R/X7R 多层陶瓷电容以获得低 ESR 与良好瞬态响应,必要时并联多个电容以提高电容量并分散寄生。
  • 输入电容:将高品质陶瓷旁路电容尽量靠近器件 VIN 与 GND 引脚放置,减小回路面积,抑制开关噪声。
  • 布局要点:SW、输入电容与功率回路之间应保持最短且粗的走线;热沉垫须打满铜并通过多孔过孔导热至 PCB 内层或下层散热区;将 FB 与参考电路走线远离开关节点以降低误差与噪声干扰。
  • 软启动与工作状态:利用外接电容/电阻设置软启动时间(参考参考设计),并为工作指示/使能信号预留稳健的滤波与上拉/下拉策略。

五、安全与可靠性说明

  • 过流保护:器件内建过流检测与打嗝限流(hiccup)功能,在持续短路或重载条件下能够自动周期性恢复尝试,降低器件及系统热损伤风险。
  • 热保护:建议在 PCB 设计中优化散热路径,利用热铜箔与过孔将热量引导至大面积散热区,确保在高负载下仍能维持安全工作温度。
  • 组件选型:为确保长期可靠,建议使用具备合格温度特性的电感、电容与连接器,并按实际环境预留裕量。

六、选型建议与总结

MP8770CGQ‑Z 适合需要高密度、低静耗、高效率的单路降压点对点电源场合。其 700kHz 的高开关频率和内置同步整流设计使整体解决方案体积小、效率高;可调软启动和打嗝限流等保护特性则提升系统的鲁棒性。选用时请重点关注外部功率元件的电流与热裕度,并按应用场景优化布局与散热设计,以发挥器件最佳性能。

如需参考完整原理图、器件引脚与典型应用电路,请查阅 MPS 官方数据手册与参考设计文件以获得详细的电气参数与 PCB 布局示例。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.