Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MP2236CGJ-Z
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MP2236CGJ-Z
- Type
- MPS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP2236CGJ-Z
- Electronic Component
- 1
- Package
- TSOT-23-8
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.076g
- Electronic Component
- 1
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0264578801
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 3V~18V
- Switching Frequency
- 480kHz~720kHz
- Electronic Component
- Electronic Component
- Output Voltage
- 600mV~8V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP2236CGJ-Z 产品概述
一、产品简介
MP2236CGJ-Z 是 MPS（Monolithic Power Systems）推出的一颗高效率、低静态电流的同步降压开关稳压器，封装为 TSOT-23-8。器件工作电压范围宽（3V～18V），输出电压可调（600mV～8V），最大输出电流可达 6A，适用于对体积、效率和成本有综合要求的点对点供电场合。
二、主要特性
- 降压拓扑、内置功率开关（同步整流），无需外接二极管，效率高。
- 输入电压范围：3V～18V；输出电压：600mV～8V（外部分压电阻可调）。
- 最大输出电流：6A，适合中高电流点负载。
- 开关频率：480kHz～720kHz，可缩小外部电感与电容体积，利于小型化设计。
- 极低静态电流 Iq = 550μA，有利于电池系统待机功耗控制。
- 保护功能：逐波限流（cycle-by-cycle）、过流保护、打嗝限流（hiccup），提高系统可靠性。
- 工作结温范围：-40℃～+125℃（TJ），满足工业级温度要求。
三、典型应用
- 移动电源与电池供电设备的降压点（PMIC、充电器外围电源）
- 消费类电子：机顶盒、网络设备、智能家居电源管理
- 通信设备与工业控制中的点对点电源（为 MCU、FPGA、模拟前端供电）
- 固态硬盘、存储模块及显示驱动电源
四、设计与选型要点
- 开关频率在 480kHz～720kHz 范围内可权衡效率与外设尺寸：较高频率可减小电感与电容，但需注意开关损耗与 EMI。
- 输出电感建议选择低 DCR、大电流饱和电流裕量的功率电感（常见 0.33µH～1.0µH 范围，依据输出电流和允许纹波选择）。
- 输入/输出侧建议使用低 ESR 陶瓷电容以降低纹波与提高瞬态响应；输入旁路电容应尽量靠近芯片 VIN 与地端布局。
- 散热与 PCB 布局：TSOT-23-8 封装热阻相对较大，工作在高电流时需通过铜箔散热与合理走线扩展散热路径，保证器件结温在安全范围内。
- 在有对软启动、频率补偿或禁能控制需求的系统中，应参考 MPS 官方资料选择外部补偿网络与控制引脚配置。
五、封装与可靠性
MP2236CGJ-Z 采用 TSOT-23-8 小型封装，便于空间受限的应用板级集成。器件具有多重保护策略，能在短路或过载情况下通过打嗝限流等机制保护系统并自动恢复，适合需要高可靠性与容错能力的电源设计。
总结：MP2236CGJ-Z 是一款面向中高电流、体积受限且对效率与稳压性能有较高要求的同步降压稳压器，凭借宽输入范围、内置功率MOSFET 与丰富的保护功能，适合各种嵌入式与电源管理场景。对于具体电路参数与参考设计，请参阅 MPS 官方数据手册与评估板资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
