WMSIC Electronic Components

MPS MP174AGS-Z

MPS MP174AGS-Z
1 / 2

Product image

ModelMP174AGS-Z
PackageSOIC-8
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
MPS MP174AGS-Z
Type
MPS
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP174AGS-Z
Electronic Component
1
Package
SOIC-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.384g
Electronic Component
1
Features
(OTP); (SCP); (CV); (UVP)
Electronic Component
BM0221776874
Electronic Component
CCM；DCM
Operating Temperature
40℃~+125℃
Operating Voltage
5.3V~5.6V
Isolation
Non-isolated
Output Voltage
12V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP174AGS-Z 产品概述

引言

MP174AGS-Z 是 Monolithic Power Systems Inc.（MPS）推出的一款高效集成电路，专为离线开关电源应用而设计。该器件集成了多种拓扑结构，包括升压、降压、降压-升压以及反激拓扑，能够满足多种电源转换需求。MP174AGS-Z 具备可靠的性能和可靠的故障保护机制，适用于广泛的电子设备和工业应用。

基础参数

MP174AGS-Z 的工作电压范围为 5.3V 到 5.6V，额定功率高达 5W，能为需要稳定电源的设备提供所需的电力。器件的电压击穿能力高达 700V，确保了在高电压环境下的安全使用，适合于各种高压电源设计中的应用。

包装和封装

该器件采用 8-SOIC 封装，具有较小的尺寸（0.154 英寸，3.90mm 宽），适合表面贴装型（SMT）安装，便于在空间有限的电路板上实施。其卷带（TR）包装形式方便了大规模的自动化生产和装配，满足现代电子产品快速迭代的需求。

特性与优势

  1. 多种拓扑设计：

    • MP174AGS-Z 的灵活拓扑结构使其能够处理不同类型的电源转换需求。这种多功能性使工程师能够在同一设备中实现多种应用，降低了设计复杂性和 BOM 成本。

  2. 内置故障保护：

    • 该器件提供多种故障保护特性，包括开路、过载、超温和短路保护。这些机制提高了设备的安全性和可靠性，确保在异常工作条件下能够保持稳定运行，减少系统故障的风险。

  3. 控制特性：

    • MP174AGS-Z 具备软启动特性，能够减少启动时的电流冲击，从而保护其他电路元件。软启动有助于延长设备的使用寿命，改善整机的可靠性。

  4. 广泛的工作温度范围：

    • 器件的工作温度范围为 -40°C ~ 125°C（TJ），这一特性使得 MP174AGS-Z 能够在极端环境下可靠运行，满足汽车、工业和消费电子等领域的需求。

  5. 高输出隔离：

    • 作为一种非隔离输出设计，MP174AGS-Z 能够实现高效的能量转换，适应高功率应用，控制能量的传输并降低能耗。

应用场景

MP174AGS-Z 适用于多种应用场景，包括但不限于：

  • 工业自动化设备
  • 消费类电子产品（如电源适配器）
  • 通信设备
  • LED 驱动器
  • 嵌入式系统

总结

MP174AGS-Z 是一款功能强大的离线开关电源集成电路，具有高效的能量转换能力和可靠的故障保护特性，其广泛的工作电压和温度范围使其适用于多种应用。由于其小巧的封装和灵活的拓扑设计，MP174AGS-Z 适合在现代复杂的电源设计中使用。Monolithic Power Systems Inc. 以其卓越的产品质量和创新的电源管理解决方案，确立了在业界的领导地位，MP174AGS-Z 更是体现了这一理念的优秀代表。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.