Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MP3425DL-LF-Z
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MP3425DL-LF-Z
- Type
- MPS
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP3425DL-LF-Z
- Electronic Component
- 1
- Package
- QFN-14-EP(3x4)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.08g
- Electronic Component
- 1
- Features
- Built-in LDORegulator
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0093065196
- Operating Temperature
- 40℃~+85℃@(TA)
- Operating Voltage
- 3.1V~22V
- Switching Frequency
- 300kHz~2MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP3425DL-LF-Z 产品概述
产品描述
MP3425DL-LF-Z是一款高效的升压型DC-DC电源芯片，采用14-VFDFN（裸露焊盘）封装，适合表面贴装（SMT）技术。该芯片专为实现可调输出电压设计，最大输出电压可达55V，输出电流能力为3A，满足各种应用场景的需求。MP3425DL-LF-Z非常适合需要将较低输入电压（如锂电池电压或其他低电源电压）转换为较高电压的场合，典型应用包括电源管理、LED驱动、电动工具和便携式设备等。
主要性能参数
- 输出电压范围：该芯片允许在3.1V至55V之间调整输出电压，输出电流最大可达到3A。这使得它非常适合为各种电路供电，尤其是在变换电源需求的应用中。
- 输入电压范围：支持的输入电压范围为3.1V至22V，灵活的输入电压设计可以直接接入多种电源，包括锂电池组和稳压电源。
- 结构与封装：MP3425DL-LF-Z采用14-VFDFN（裸露焊盘）封装，有效减小了产品体积，适合于空间受限的设计。此外，其湿气敏感性等级（MSL）为1，意味着该器件在存储和焊接过程中具有极好的可靠性和适应性。
- 开关频率：工作频率范围为300kHz至2MHz，具有出色的频率调节灵活性。这在降低EMI和优化整体功率效率方面起到积极作用，用户可以根据具体应用的要求进行选择。
- 工作温度：广泛的工作温度范围为-40°C至85°C（TA），确保MP3425DL-LF-Z在各种环境条件下都能稳定运行。
应用场景 MP3425DL-LF-Z芯片的设计目标是灵活应对多种供电需求，其典型应用包括：
- 便携式电子设备：如手机、平板电脑和便携式游戏机等，这些设备常常需要将电池电压（通常在3.1V至4.2V之间）升高，为更高电压设备或内部电路供电。
- LED驱动：该芯片能够为白光或色彩LED提供稳定的驱动电压，是LED照明和信号应用中理想的选择。
- 电源管理：用于高性能的电源转换器和模块，为工业控制器、网络设备及各种传感器提供长效供电。
- 电动工具：为高功率电动工具提供必要的升压解决方案，确保其在不同工作条件下高效运作。
设计考虑 使用MP3425DL-LF-Z时，设计工程师需考量输入输出的特性，以及其他外部组件（如电感、电容器和二极管）的选择，这些元件会影响最终设计的效率和稳定性。此外，带有温度监测和过流保护功能的设计也有助于提升系统的可靠性。在实际应用中，适当的PCB布局和处理大小会显著提高系统性能，因此在设计过程中需特别注意。
结论 综上所述，MP3425DL-LF-Z是一款性能优异、用途广泛的升压DC-DC电源芯片，凭借其出色的电压调节范围和高达3A的输出能力，成为许多电子设备设计师的首选。无论是工业应用、便携式设备，还是LED驱动，这款芯片都能够提供稳定、可靠的电源解决方案，满足日益增长的高效能电源需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
