WMSIC Electronic Components

MPS MPQ2179GQHE-AEC1-Z

ModelMPQ2179GQHE-AEC1-Z
PackageQFN-8(1.5x2)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MPQ2179GQHE-AEC1-Z
Type
MPS
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPQ2179GQHE-AEC1-Z
Electronic Component
1
Package
QFN-8(1.5x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.023g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0229987514
Operating Temperature
40℃~+150℃@(TJ)
Operating Voltage
2.5V~5.5V
Switching Frequency
2.4MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPQ2179GQHE-AEC1-Z 产品概述

一、器件概述

MPQ2179GQHE-AEC1-Z 是 MPS(Monolithic Power Systems)的一款工业/汽车级降压型开关稳压器,封装为 QFN-8 (1.5 × 2 mm)。器件为内置开关管的降压拓扑(非同步整流),工作电压范围 2.5V 至 5.5V,固定开关频率 2.4MHz,最大连续输出电流可达 3A,支持可调输出。器件工作结温范围达 -40℃ 至 +150℃(TJ),满足汽车级高温要求(AEC 标定)。

二、主要规格亮点

  • 输入电压:2.5V ~ 5.5V,适配 3.3V/5V 系统电源。
  • 输出电流:最高 3A,适合中等功率负载。
  • 开关频率:2.4MHz,高频允许采用更小尺寸的电感与陶瓷电容,节省 PCB 面积。
  • 静态电流:Iq ≈ 460µA,轻载效率较好(但因非同步整流,轻载下整流损耗依然存在)。
  • 内置开关管:简化设计与布局,但需外接整流二极管(肖特基)以完成回路。
  • 汽车级工作温度与封装适合严苛应用场景。

三、典型应用

  • 汽车电子:仪表、车载网关、摄像头/传感器电源(需参考 AEC 要求)。
  • 工业控制与通信终端:模块化电源、驱动电路的中间总线降压。
  • 便携与消费电子:需要小尺寸、高频降压的电源管理(在 5V 或 3.3V 输入下)。

四、外部元件选型与参考

  • 整流二极管:由于为非同步结构,必须选用低正向压降肖特基二极管,额定电流 ≥3A,低 Vf 有助于提升效率。
  • 电感:建议选用低 DCR、饱和电流高于峰值电流的功率电感。针对 2.4MHz,典型电感值范围可在 0.47µH ~ 2.2µH 之间选择,依据允许的电流纹波与效率权衡。
  • 输入/输出电容:建议使用 X5R/X7R 陶瓷电容以降低 ESR。输入端 4.7µF ~ 10µF,输出端 10µF ~ 47µF(并联小容值以改善瞬态响应)。
  • 反馈网络:通过外接分压电阻设定输出电压,反馈节点布线应尽量短。

五、布局与热管理建议

  • QFN 裸露散热焊盘需接地且与大面积地铜箔相连,利于散热。
  • 输入电容靠近 VIN 与 GND 引脚放置,肖特基二极管应靠近开关节点与地端布置以缩短环路。
  • 开关节点(SW)走线尽量短、远离敏感模拟信号与反馈回路,减小 EMI。
  • 在高环境温度或接近 3A 输出时注意热限,必要时在 PCB 加强散热区域或增加铜厚。

六、使用注意与建议

  • 由于为非同步整流器件,在高电流下整流损耗明显,效率会低于同步方案;在效率为关键的场合,可权衡是否选择同步器件。
  • 参考官方数据手册获取具体的启动/关闭时序、反馈参考电压、保护功能(短路保护、过温关断等)与典型效率曲线。
  • 调试时关注负载瞬态响应与环路稳定性,必要时调整输出电容和拓扑元件以优化性能。

如需具体典型电路、元件清单或在特定输入/输出条件下的效率与热仿真数据,请提供目标 Vin、Vout 及负载要求,以便给出更精确的设计建议。

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