WMSIC Electronic Components

MPS MP6951GJ-Z

ModelMP6951GJ-Z
PackageTSOT-23-6
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP6951GJ-Z
Type
MPS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP6951GJ-Z
Electronic Component
1
Package
TSOT-23-6
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.047g
Electronic Component
1
Features
Synchronous Driver; (OTP);; (OVP)
Electronic Component
BM0227783290
Electronic Component
CCM;QR;DCM
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~13V
Switching Frequency
1MHz
Electronic Component
Electronic Component
Isolation
Isolated

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP6951GJ-Z 产品概述

一、产品简介

MP6951GJ-Z 是 MPS 推出的一款面向隔离型反激式开关电源的开关控制器,集成“Fast Turn-Off Rectifier for Flyback”概念与智能 VDS 振铃感知功能。器件工作电压范围为 4.5V~13V,可在高达 1MHz 的开关频率下稳定工作,支持 CCM、DCM、QR 及 ZVS 等工作模式,适合高密度、低空载损耗的隔离式电源设计。

二、主要特性

  • 工作电压:4.5V ~ 13V,适配多种驱动与偏置方案。
  • 开关频率:最高可达 1MHz,满足高频、高功率密度设计要求。
  • 功耗:耗散功率 Pd = 560mW(典型热预算参考)。
  • 拓扑:专为反激式(Flyback)设计,支持隔离型输出。
  • 模式兼容性:支持 CCM、DCM、QR 及实现 ZVS 的工作方式,提高效率并降低开关应力。
  • 保护功能:集成过热保护(OTP)与过压保护(OVP),增强系统可靠性。
  • 封装:TSOT-23-6,体积小,利于空间受限的应用。
  • 工作温度:-40℃ ~ +125℃,适用于工业级环境。

三、核心优势

  • 智能 VDS 振铃感知:对 MOSFET VDS 振铃进行实时监测与智能处理,配合快速关断整流策略(Fast Turn-Off),能显著减少能量耗散和应力峰值,降低对传统 RCD/有源箝位的依赖。
  • 高频能力:1MHz 工作能力有利于缩小磁性元件体积、降低整体 BOM 成本。
  • 多模支持:兼容多种工作模式,设计时可在效率、体积和 EMI 之间取得更优折衷。

四、典型应用场景

  • 手机及平板适配器、小功率充电器(隔离式)
  • 工业与通信设备的辅助隔离电源
  • 电视、电源板的待机与辅助电源
  • 任何需高密度、低待机损耗的反激式隔离电源

五、封装与散热建议

TSOT-23-6 小封装便于紧凑布板,但散热能力有限。设计时应:

  • 将散热铜箔尽量扩展到 PCB 底层并与器件引脚相连;
  • 保证输入侧与变压器、绕组及功率走线的合理间距以减小寄生振铃;
  • 在高频、小体积设计中评估 Pd=560mW 的热预算,必要时考虑外部散热或降低工作温度。

六、设计注意事项

  • 开关频率与磁芯选择:高频可减小磁芯尺寸,但要兼顾磁损与温升。
  • VDS 振铃优化:虽然器件具备智能振铃感知,仍建议配合合理的漏感控制、变压器设计与 PCB 布局以获得最佳 EMI 与效率。
  • 保护与调试:利用内置 OVP/OTP 保护,同时在原型阶段充分验证不同负载、空载与异常工况下的稳定性。
  • 器件匹配:选择与器件工作点匹配的功率 MOSFET、肖特基二极管(若外置)与磁性元件,确保整体系统效率与可靠性。

MP6951GJ-Z 面向追求高功率密度与高效率的隔离反激电源应用,兼顾多种工作模式与保护功能,是需要在体积、效率与可靠性之间取得良好平衡的设计的理想选择。若需进一步的电气特性曲线、引脚功能与参考设计建议,请参考官方数据手册与参考电路。

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