Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MP3301GJ-Z
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MP3301GJ-Z
- Type
- MPS
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP3301GJ-Z
- Electronic Component
- 1
- Package
- TSOT-23-5
- Type
- DC-DC
- Electronic Component
- LEDDriver
- Electronic Component
- Analog; PWM
- Electronic Component
- 0.287g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Built-in; LED; (OTP)
- Electronic Component
- BM0000286087
- Operating Temperature
- 40℃~+125℃
- Switching Frequency
- 1.3MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP3301GJ-Z 产品概述
概述
MP3301GJ-Z是一款高性能的升压DC-DC稳压器，由MPS（Monolithic Power Systems）制造，专为高效能LED驱动应用而设计。其单通道的设计能够提供高达36V的输出电压，最大输出电流可以达到1A，非常适合需要高电压和高效率的照明设备和其它电子应用。
重要特性
MP3301GJ-Z的关键特性包括：
- 输出电压与电流：该器件能在输入电压范围2.5V至6V下，稳定输出高达36V的电压，适合直接驱动高功率LED。
- 集成开关：内部集成开关的设计简化了布局，提高了系统的效率和可靠性，减少外部元件数量。
- 调光功能：支持模拟和PWM调光方式，使其在各种照明应用中能够实现灵活的亮度控制，这为设计师提供了更多创意空间，可以根据需求调整LED灯的亮度和色温。
- 高开关频率：工作频率高达1.3MHz，有效减小了外部元件（如电感和电容）的体积，可实现更为紧凑和灵活的PCB设计。
- 工作温度范围： MP3301GJ-Z的工作温度范围为-40°C到125°C，使其可以在极端温度条件下稳定工作，适合各种工业和汽车应用。
应用场景
由于其卓越的性能和设计灵活性，MP3301GJ-Z适用于多个应用领域：
- LED照明：该器件可用作高效率的LED驱动器，通过PWM调光实现高品质的可变亮度照明，适合用于住宅、商业和户外照明。
- 移动设备：在需要紧凑型设计和长电池续航的移动设备中，MP3301GJ-Z的高效率和小表面贴装封装（TSOT-23-5）使其成为理想选择。
- 汽车电子：由于其宽广的工作温度范围，该IC也适合应用于汽车LED照明系统，比如车内氛围灯和外部信号灯。
- 其他消费电子：可广泛应用于其他消费电子产品中，能够满足各类设备对高压、高效率电源的需求。
封装与安装
MP3301GJ-Z采用SOT-23-5细型封装，具有紧凑的表面贴装(SMT)设计，适用于现代自动化焊接工艺。这种封装形式不仅有助于节省印刷电路板的空间，还提升了散热性能，确保其在高功率应用中可靠运行。
性能与优势
MP3301GJ-Z不仅具有优良的电源稳定性和调光功能，其高达1A的输出电流和36V的高输出电压使得该器件在驱动LED等高功率应用方面表现突出。此外，它的湿气敏感性等级（MSL）为1，意味着它可以在一般环境下长时间存储而不需要特殊的干燥处理，大大方便了生产和供应链管理。
总结
MP3301GJ-Z是为当今高效能和灵活性需求而设计的升压DC-DC稳压器，凭借其高输出电压、优异的调光功能和稳健的工作温度范围，在众多应用中都展现出广泛的适用性和先进的性能。MPS的这一产品将是设计师们在LED驱动和其它高压应用中的一个重要选择，不仅提升了产品的市场竞争力，也为最终用户带来了更高效、更稳定的使用体验。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
