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MPS MP2384GG-Z
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MP2384GG-Z
- Type
- MPS
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP2384GG-Z
- Electronic Component
- 1
- Package
- QFN-11(2x2)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.041g
- Electronic Component
- 1
- Features
- Output
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0058432942
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 4.5V~24V
- Switching Frequency
- 700kHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP2384GG-Z 产品概述
一、概述
MP2384GG-Z 是一款降压型同步整流 DC-DC 开关稳压器，面向对效率、体积和负载能力有较高要求的电源应用。芯片集成高侧和低侧开关管，采用 700kHz 固定开关频率和 QFN-11 (2×2mm) 小型封装，支持 4.5V24V 宽输入电压，输出可调 0.6V13V，最高输出电流 4A，适合为点对点电源和板载供电提供紧凑、高效的降压解决方案。
二、主要参数与特性
- 输入电压范围：4.5V ~ 24V
- 输出电压范围：0.6V ~ 13V（可调）
- 最大输出电流：4A
- 开关频率：700kHz（固定）
- 静态电流：105µA（轻载高效模式）
- 开关管：内部集成高/低侧 MOSFET（同步整流）
- 拓扑结构：降压（Buck）单通道
- 工作结温度：-40℃ ~ +125℃（TJ）
- 封装：QFN-11 (2×2mm)
- 保护与功能：逐波限流（cycle-by-cycle）、打嗝限流（hiccup）、过流保护、输出放电、工作状态指示、保护锁死（故障锁定）
- 特殊模式：轻载高效率工作模式以降低空载/轻载损耗
三、应用场景
- 工业控制与自动化板载电源
- 通信与网络设备的辅助供电
- 工业与消费类便携设备的中低压降压模块
- MCU、FPGA 和 SoC 的局部稳压电源
- 电池供电系统或车载辅助电源（需符合系统级安全需求）
四、封装与热管理
QFN-11 (2×2mm) 小封装便于空间受限设计，但对热阻较为敏感。建议在 PCB 设计时：
- 在芯片底部并联地平面作为散热垫，通过多层过孔连接到内层/底层铜箔；
- 输入侧放置足够的陶瓷旁路电容（低 ESR）并靠近 VIN 引脚；
- SW 节点走线尽可能短，输出电感、二极管（若外置）及电容布局紧凑以降低 EMI 与切换损耗。
五、设计与选型建议
- 电感选择：选用直流电阻（DCR）低、饱和电流高于最大输出电流的功率电感；
- 输出电容：优选 X7R 陶瓷，足够容量与合适 ESR 以保证环路稳定性与低纹波；
- 输入滤波：在 VIN 端并联陶瓷与电解/钽电容以处理高频与中低频纹波；
- 保护设置：根据系统需求合理利用芯片的打嗝限流与保护锁死特性，必要时在系统层面加入上电/再上电策略以防止误触发。
六、可靠性与注意事项
- 在高温或高输入电压工况下注意热去耦与降额设计；
- 轻载高效模式虽能降低空载损耗，但在对瞬态响应有严格要求的场合需验证动态性能；
- 在并联或多相替代方案中应关注启动顺序与共享电流特性。
总结：MP2384GG-Z 以紧凑封装、宽输入范围、高效率和完整的保护功能，适合对板载降压电源有空间与功率密度要求的设计。合理的 PCB 热设计和外围器件选择可充分发挥其性能。
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