WMSIC Electronic Components

MPS HR1001AGS-Z

ModelHR1001AGS-Z
PackageSOIC-16
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
MPS HR1001AGS-Z
Type
MPS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
HR1001AGS-Z
Electronic Component
1
Package
SOIC-16
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0g
Electronic Component
1
Electronic Component
BM0264570817
Operating Voltage
8.9V~15.5V
Switching Frequency
600kHz
Isolation
Isolated
Power Dissipation(Pd)
1.56W
Electronic Component
Electronic Component
Electronic Component
2500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

HR1001AGS-Z 产品概述

一、产品定位与核心特性

HR1001AGS-Z 是一款面向离线隔离电源的半桥控制器/转换器解决方案(封装:SOIC-16,品牌:MPS)。器件支持隔离输出、工作电压范围 8.9V ~ 15.5V,开关频率固定为 600kHz,内部或配套器件可承受最高晶体管耐压 600V,最大占空比 50%。该器件专为高效率、紧凑体积的离线电源设计,适合中小功率适配器、模块化电源和工业/家电类隔离供电场景。

主要功能特性包括:

  • 轻载高效模式,提升空载和轻载下能效;
  • Brown-in / Brown-out 检测,保障输入电压上下限敏感响应;
  • 可调软启动,限制启动浪涌、减少输出过冲;
  • 打嗝限流(hiccup limit),在持续过流时进行周期性恢复尝试,避免器件或负载损坏;
  • 过热保护(OTP)、欠压锁定/欠压保护(UVP)、过流保护(OCP);
  • 副边反馈(secondary-side feedback)实现精确的输出电压调节。

二、主要电气与热参数

  • 工作电压:8.9V ~ 15.5V(参考输入/辅助电源电压范围)
  • 开关频率:600kHz(有利于变压器与磁组件的小型化)
  • 最大占空比:50%(半桥拓扑的安全工作范围)
  • 晶体管耐压:600V(适应离线高压应力)
  • 耗散功率 Pd:1.56W(封装与布局需考虑散热)
  • 工作温度范围:-40 ℃ ~ +125 ℃

三、拓扑与应用建议

HR1001AGS-Z 基于半桥式拓扑,结合 600kHz 的开关频率,可在保证转换效率的同时显著减小磁组件体积,适合以下应用:

  • 小型离线开关电源模块与适配器(需隔离输出)
  • LED 驱动电源与恒流模块(需要副边精确反馈)
  • 工业控制与通信设备的孤离供电模块
  • 具有轻载高效与省电要求的消费类电源

在实际应用中常用副边反馈(如光耦+参考或副边内置参考与反馈回路)实现输出稳压;软启动与打嗝限流配合能显著提升系统可靠性与对异常工况的自恢复能力。

四、设计与布局注意事项

  • 散热管理:器件最大耗散功率约 1.56W,SOIC-16 封装对散热敏感,建议在 PCB 上设计充分的铜箔放热区域并优化走线以降低结温。
  • 开关回路布线:保持主开关回路最短最粗,降低 EMI 与寄生环路面积;输入滤波与共模电感应合理布局以抑制干扰。
  • 隔离和安全:确保一次侧与二次侧满足安全距离与爬电路径要求;采用符合安全标准的隔离元件与磁组件。
  • 反馈稳定性:副边反馈环路需按照负载与输出滤波设计补偿网络,避免环路振荡或过渡响应不佳。
  • 保护协同:合理设置 UVP/OCP/OTP 门限和延时,配合打嗝限流策略,以兼顾保护灵敏度与避免误动作。

五、可靠性与选型提示

HR1001AGS-Z 在扩展温度范围内工作,适用于要求长期稳定性的工业级产品。选型时请确认:

  • 系统工作电压与启动/辅助供电能覆盖 8.9V~15.5V 范围;
  • 系统最大电压应在晶体管耐压 600V 之内并留有裕量;
  • 根据输出功率估算耗散并设计散热方案;
  • 若对低待机功耗有严格要求,需验证轻载高效模式在目标工况下的实际表现。

如需把 HR1001AGS-Z 集成到现有方案中,建议基于参考设计进行仿真与板级验证,重点关注 EMI、热性能和反馈环路稳定性,以获得可靠、效能均衡的最终产品。

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