WMSIC Electronic Components

MPS MP3437GRP-Z

ModelMP3437GRP-Z
PackageQFN-10(2x2.5)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP3437GRP-Z
Type
MPS
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP3437GRP-Z
Electronic Component
1
Package
QFN-10(2x2.5)
Electronic Component
DC-DC Power Supply IC
Electronic Component
1g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0258859728
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
800mV~16V
Switching Frequency
500kHz~700kHz
Electronic Component
Electronic Component
Output Current
9.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP3437GRP‑Z 产品概述

一、概述

MP3437GRP‑Z 是一款升压型同步整流开关稳压器,属于 DC‑DC 电源芯片类,封装为 QFN‑10 (2×2.5mm)。器件内部集成开关管,工作开关频率为 600kHz,输入电压范围为 0.8V 到 16V,输出电压可调同样覆盖 0.8V 到 16V,单通道输出。工作结温范围为 ‑40℃ 到 +125℃(TJ),适合对空间与功耗有较高要求的升压场合。

二、主要特性

  • 升压拓扑,支持输出电压可调;
  • 同步整流,降低整流损耗、提高转换效率;
  • 内置高侧/低侧开关,简化外部器件并节省 PCB 面积;
  • 固定约 600kHz 开关频率,利于外部滤波元件小型化;
  • 宽输入/输出电压范围(0.8V~16V),兼容单节锂电池及多种电源输入;
  • 商用-工业级温度范围(‑40℃~+125℃),适合严苛环境。

三、典型应用

  • 便携式电子产品(如单节锂电池升压);
  • 物联网/可穿戴设备电源管理;
  • 车载低压电源辅助升压(需注意车规要求);
  • LCD/驱动电源或其它需要小体积高效率升压的场景。

四、封装与热管理

器件为 QFN‑10 (2×2.5mm) 小型封装,适合高密度布局。由于内部集成开关,功率损耗集中于封装,印制板布局应注意热扩散:在器件底部使用焊盘/散热焊盘并做多层过孔热通,输入/输出电容和电感尽量靠近引脚布置,以降低寄生和温升。

五、设计建议

  • 电感:选择适合 600kHz 的磁芯和电流额定值,注意饱和电流要高于最大峰值电流;
  • 输入/输出滤波:采用低 ESR 电容,靠近 VIN/GND、VOUT/GND 引脚放置以抑制纹波与峰值电流回路;
  • PCB 布局:缩短开关节点(SW)、电感与电容间的回流路径,增大地平面,减少环路面积;
  • 稳定性与补偿:根据应用负载和输出电容选择合适的补偿网络或按厂家参考设计走板;
  • 保护与功能:实现必要的软启动、过流与过温保护(若器件内建需参考手册),并在系统级考虑启动顺序与断路情形。

六、选型提示

在采用 MP3437GRP‑Z 前,请结合系统所需最大输出电流、效率目标、输出纹波及工作环境温度,查阅厂商数据手册的详细参数、典型应用电路与 PCB 布局示例,按推荐外围元件进行设计验证。

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