WMSIC Electronic Components

MPS MPQ3367GR-AEC1-Z

ModelMPQ3367GR-AEC1-Z
PackageQFN-24(4x4)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MPQ3367GR-AEC1-Z
Type
MPS
Unit
Electronic Component
Minimum package
5000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPQ3367GR-AEC1-Z
Electronic Component
1
Package
QFN-24(4x4)
Type
DC-DC
Electronic Component
LEDDriver
Electronic Component
PWM; Analog
Electronic Component
0.29g
Electronic Component
1
Channel Count
6
Features
(OVP); LED; Built-in; (OTP); (SCP)
Electronic Component
BM0264685970
Operating Temperature
40℃~+125℃
Switching Frequency
400kHz~2.2MHz
Electronic Component
2.5%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPQ3367GR-AEC1-Z 产品概述

一、产品简介

MPQ3367GR-AEC1-Z 是 MPS(Monolithic Power Systems)推出的一款多通道升压型 LED 驱动器,适用于需要高密度恒流输出的照明场合。器件采用升压拓扑,内置开关管,支持 6 路独立输出,每路最大恒流 150 mA,输入电压范围宽(3.5 V ~ 36 V),工作频率可在 400 kHz ~ 2.2 MHz 之间调节,封装为 QFN-24(4 mm × 4 mm),并针对苛刻环境设计,工作温度范围 -40 ℃ ~ +125 ℃。

二、主要特性

  • 6 路独立恒流输出,单通道最大 150 mA。
  • 输入电压:DC 3.5 V ~ 36 V,适应多种电源方案。
  • 开关频率范围:400 kHz ~ 2.2 MHz,支持占空比与电磁兼容(EMC)权衡。
  • 恒流精度:2.5%,保证 LED 亮度一致性。
  • 调光方式:PWM 与模拟调光,支持灵活亮度控制与分组管理。
  • 内置开关管,简化外部器件选型与系统尺寸。
  • 完善保护功能:过压保护(OVP)、LED 开路保护、软启动、过温保护(OTP)与短路保护(SCP)。
  • 汽车/工业级温度范围(-40 ℃ ~ +125 ℃),型号后缀 AEC1 指向面向更严格环境的设计与可靠性考量。
  • 封装:QFN-24(4×4 mm),利于高密度 PCB 布局。

三、电气与控制要点

  • 恒流驱动:每通道恒流输出可实现高精度恒流控制,适合串联或并联多颗 LED 的应用。
  • 调光接口:支持 PWM 调光以实现无级亮度控制并减少色漂;同时支持模拟调光,用于平滑亮度调整或与模拟电路联动。
  • 开关频率选择:高频工作可减小外部电感和电容体积,但需权衡效率与 EMI;可在 400 kHz 至 2.2 MHz 之间根据系统需求优化。

四、保护与可靠性设计

  • 内置软启动:限制启动电流冲击,避免对电源造成冲击并减少 LED 应力。
  • LED 开路/短路保护:提高系统在异常工作时的安全性并防止器件损坏。
  • 过温保护与过压保护:在极端条件下保证系统安全和可靠运行。
  • 适用于汽车/工业级应用环境,具备较宽温度余量和耐受能力。

五、封装与散热注意

  • QFN-24(4×4 mm)封装体积小、热性能良好,但需在 PCB 设计上重视散热通道。
  • 推荐在 PCB 底部开大热焊盘并焊接到地平面,通过多通孔过孔将热量传导到内部散热层。
  • 布局上应缩短高电流回路、将输入/输出电容靠近相关引脚安放,并尽量隔离开关节点与敏感模拟信号。

六、典型应用场景

  • 汽车内饰/外饰 LED 照明(阅读灯、氛围灯、车门灯等)。
  • 工业与商业照明(线性灯、筒灯、面板灯等)。
  • 背光与显示照明、标识与指示灯系统。
  • 需要多路恒流、紧凑尺寸与高可靠性的便携或固定照明设备。

七、布局与应用建议

  • 选用低 DCR、额定电流充分裕度的外部电感;根据驱动电流与占空比计算电感电流纹波并验证温升。
  • 输入电容和输出旁路电容应靠近器件引脚并满足低等效串联电阻(ESR)要求。
  • PWM 调光信号要具备良好上升/下降沿和合适频率(避免可见闪烁),模拟调光需注意滤波与阻抗匹配。
  • 参考原厂典型应用电路和 PCB 布局示意,按数据手册进行反馈网络与补偿参数的调试,以确保环路稳定与过渡特性。

总结:MPQ3367GR-AEC1-Z 在紧凑封装中集成 6 路高精度恒流升压驱动与全面保护功能,适合对体积、可靠性与恒流一致性有较高要求的照明系统。更多详细电气参数、典型应用图与布局建议请参考 MPS 官方资料与器件数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.