Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MPQ8632GLE-6-Z
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MPQ8632GLE-6-Z
- Type
- MPS
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MPQ8632GLE-6-Z
- Electronic Component
- 1
- Package
- QFN-16(3x4)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 110g
- Electronic Component
- 1
- Features
- Built-in LDORegulator
- Type
- Electronic Component
- Electronic Component
- BM0000001515
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 2.5V~18V
- Switching Frequency
- 200kHz~1MHz
- Electronic Component
- Electronic Component
- Output Voltage
- 611mV~13V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MPQ8632GLE-6-Z 产品概述
一、产品简介
MPQ8632GLE-6-Z是一款高性能的降压DC-DC电源管理芯片，专为满足各种电源需求而设计。该芯片具有可调输出电压范围、强大的输出电流能力及高效率的同步整流特性，使其成为众多电子产品和系统中的理想选择。其紧凑的QFN封装使得其在空间受限的应用中也能高效运行，广泛应用于便携式设备、工业电源、通信设备等多个领域。
二、主要特点
功能与拓扑：MPQ8632GLE-6-Z采用降压拓扑结构，具备正输出配置，能够将较高的输入电压转换成所需的低电压输出。
可调输出：该芯片支持可调输出，无需固定电压配置，输出电压范围从0.611V到13V，能够满足不同设备和应用的电源需求，灵活性较高。
输出电流能力：MPQ8632GLE-6-Z的输出电流高达6A，确保能够给予所连接负载充分的电力支持，适用于功耗较大的设备。
高开关频率：芯片内部开关频率可调范围为200kHz到1MHz，提供了优化效率与电磁干扰（EMI）之间的灵活性，可以根据具体应用情况选择最优工作频率。
同步整流器：内置同步整流功能，可以进一步提升转换效率，减少功耗，特别适合在高负载条件下使用，保障系统运行更为稳定。
宽输入电压范围：该芯片的输入电压范围从4.5V到18V，能够适应多种电源输入场景，为设计提供了极大的便利。
广泛的工作温度范围：MPQ8632GLE-6-Z的工作温度范围为-40°C至125°C，适用于严苛的环境条件，包括工业和汽车应用，确保在高温或低温环境下也能正常工作。
三、封装与安装类型
MPQ8632GLE-6-Z采用16-VFQFN封装（3x4 mm），其表面贴装设计使得在现代电路板设计中非常便捷。QFN封装不仅可以有效节省空间，还具备良好的散热性能，适合高电流应用而不易过热。
四、应用场景
MPQ8632GLE-6-Z适合用于各类电子设备和系统，包括但不限于：
便携式设备：如移动电话、平板电脑、便携式游戏机等，能够优化电池使用效率，延长设备使用时间。
工业电源：用于工业控制系统及设备，为传感器、执行器及其他工业模块提供稳定电源。
通信设备：广泛应用于通信基站、路由器等网络设备，以保障其长期稳定运行。
汽车电子：在汽车供电系统中提供高效的电源管理，支持各种车载电子设备的稳定工作。
五、总结
MPQ8632GLE-6-Z是一款功能强大、灵活性高、效率出色的降压DC-DC电源芯片，凭借其杰出的技术规格，无论是在便携式消费电子、工业自动化，还是在通信与汽车等其他应用中均能发挥重要作用。其出色的性能表现，结合紧凑的封装设计，使得此产品成为市场上深受欢迎的电源管理解决方案，能够满足不断发展与变化的电子应用需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
