WMSIC Electronic Components

MPS MP2317GJ-Z

ModelMP2317GJ-Z
PackageTSOT-23-6
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP2317GJ-Z
Type
MPS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP2317GJ-Z
Electronic Component
1
Package
TSOT-23-6
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.024g
Electronic Component
1
Features
Built-in LDORegulator;;; EMI Optimization
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0058433133
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
7.5V~26V
Switching Frequency
600kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP2317GJ-Z 产品概述

一、产品简介

MP2317GJ-Z 是一款降压型同步整流 DC-DC 转换器,采用降压拓扑并内置功率开关,工作电压范围宽(7.5V~26V),输出可调(3.3V~24V),最大输出电流 1A,开关频率 600kHz,静态电流仅 150µA,工作结温范围 -40℃~+125℃(TJ)。器件以 TSOT-23-6 小封装提供,适合空间受限且对功耗与热量有严格要求的便携及工业电子应用。

二、主要特性

  • 宽输入电压:7.5V~26V,适配多种电源母线及电池组。
  • 可调输出:支持 3.3V~24V 输出电压,灵活匹配不同负载需求。
  • 输出电流:最高 1A,适用于中小功率负载供电。
  • 内置开关与同步整流:集成高侧与低侧开关,提高效率、降低外部元件数量。
  • 开关频率:600kHz,兼顾外形尺寸和瞬态响应,便于使用小体积电感与电容。
  • 低静态电流:150µA,有利于轻负载或待机功耗控制。
  • 宽工作温度与小封装:-40℃~+125℃(TJ)与 TSOT-23-6,适合工业级应用与紧凑设计。

三、典型应用场景

  • 工业控制与仪表:为单片机、模拟前端、传感器供电。
  • 通信与分布式电源:边缘设备、网关、接口电源。
  • 汽车电子(非安全关键子系统):适配车载 12V/24V 总线(需按车规验证)。
  • 消费类与便携设备:小型模块、显示驱动、外围供电等。

四、设计要点与建议

  • 输入/输出滤波:建议在输入侧靠近芯片放置低 ESR 陶瓷电容,以抑制开关噪声与瞬态尖峰;输出侧采用合适容值与类型的陶瓷电容以保证稳定性与瞬态响应。
  • 电感选型:选用额定电流高于 1A、低 DCR 的功率电感。600kHz 开关频率允许使用较小体积电感,但需兼顾饱和电流与效率。
  • 布局与散热:在 PCB 上尽量缩短开关回路(开关节点、外置电感与输入/输出电容)走线,并采用局部大面积铜箔散热;TSOT-23-6 封装热阻相对较高,注意热源分布与多层板散热设计。
  • 启动与保护:参考厂商资料确定软启动、过流与过温保护机制;设计时预留足够裕量以防启动时的大瞬态电流或短路工况。

五、封装与可靠性

MP2317GJ-Z 提供 TSOT-23-6 小封装,适合自动贴装与高密度 PCB。器件额定工作结温 -40℃~+125℃,在高温应用中应注意降额使用与热管理策略,以保证长期可靠性。

六、使用与获取

在设计前请参考完整数据手册与参考设计,确认外部元件选型、补偿网络与测试条件。评估板、参考电路及器件可通过 MPS 官方渠道或授权分销商获取,以加速原型验证与量产导入。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.