WMSIC Electronic Components

MPS MP28167GQ-Z

ModelMP28167GQ-Z
PackageQFN-16(3x3)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MP28167GQ-Z
Type
MPS
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP28167GQ-Z
Electronic Component
1
Package
QFN-16(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.17g
Electronic Component
1
Features
Built-in LDORegulator;; Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227777013
Operating Temperature
40℃~+125℃
Operating Voltage
2.8V~22V
Switching Frequency
500kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP28167GQ-Z 产品概述

一、核心参数

  • 功能类型:升降压型(降压-升压式)
  • 输入电压范围:2.8V ~ 22V
  • 输出电压:固定 5.0V
  • 输出电流:最大 3A
  • 开关频率:500 kHz
  • 静态电流(Iq):约 1 mA
  • 同步整流:支持(内部同步开关)
  • 开关管:内置
  • 输出通道数:1 路
  • 工作温度:-40 ℃ ~ +125 ℃
  • 封装:QFN-16 (3 mm × 3 mm)
  • 品牌:MPS(Monolithic Power Systems)

二、产品简介

MP28167GQ-Z 是一款面向广泛工业与便携应用的单通道升降压稳压器,采用降压-升压拓扑并集成同步整流与功率开关,能在输入电压高于或低于目标 5V 时保持稳定输出。500 kHz 的工作频率在保持效率与外围元件体积之间取得了平衡,内置开关减少了外部元件复杂度,静态电流低至约 1 mA,适合对待机功耗有要求的系统。

三、主要特性与保护(典型)

  • 宽输入电压范围,适配电池、点火电源及工业电源等场景
  • 内置高效同步开关,提升效率并降低外部二极管需求
  • 固定 5V 输出,最大支持 3A 负载
  • 低静态电流,利于低功耗设计
  • 常见保护功能(通常集成):过流保护、短路保护、过温保护、上电复位/软启动、欠压锁定(具体行为请参照器件数据手册)

四、典型应用场景

  • 电池供电设备:单节或多节电池的稳压输出
  • 汽车电子:车载外围模块(需注意电磁兼容与输入瞬态抑制)
  • 工业控制与传感器节点:5V 供电的传感器、驱动器与通信模块
  • 通讯与消费电子:便携式终端的 5V 供电

五、设计与布板建议

  • 电感:选择饱和电流高于 3A、低 DCR 的功率电感,值与所选电容配合满足纹波与响应要求(推荐参考厂方典型应用电路)。
  • 输入/输出电容:优先使用低 ESR 陶瓷电容,输入侧放置足够的去耦以抑制开关瞬态;输出侧按负载与纹波要求并联合适容值与材料。
  • 布局:开关节点(SW)、输入/输出电容和器件地尽量靠近,短而粗的铜迹降低寄生;暴露焊盘通过多盏通孔连接至底层大面积铜箔以增强散热。
  • 热设计:在高负载或高温工况下注意器件结温,采用热铜铺、过孔通热,必要时参考热阻数据调整散热方案。
  • EMC 与滤波:必要时在输入端添加共模/差模滤波与 TVS 防护以应对汽车或工业瞬态。

六、封装与热管理

QFN-16 (3×3 mm) 小体积有利于紧凑系统设计,但热量集中,建议焊接暴露焊盘并与大面积 PCB 铜箔相连以提升导热能力,保证在 3A 输出时的可靠性。

七、小结

MP28167GQ-Z 提供了在 2.8V–22V 输入下稳定 5V/3A 输出的紧凑方案,内置开关与同步整流简化外部设计,低静态电流适合低功耗场景。针对最终应用请参阅原厂数据手册获取典型参考电路、元件值和完整保护特性,并按应用工况优化布局与散热设计。

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