WMSIC Electronic Components

MPS MP175GS-Z

ModelMP175GS-Z
PackageSOIC-8
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP175GS-Z
Type
MPS
Minimum package
2500

Technical parameters

Electronic Component
MPS
Electronic Component
MP175GS-Z
Electronic Component
1
Package
SOIC-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.125g
Electronic Component
1
Features
Brown-in / Brown-out;; (OTP); (SCP);;; (UVP)
Electronic Component
Electronic Component
Electronic Component
BM0058433103
Electronic Component
CCM;DCM
Operating Temperature
40℃~+125℃
Operating Voltage
9V~30V
Isolation
Non-isolated
Output Current
600mA
Transistor Voltage Rating
700V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP175GS-Z 产品概述

一、产品简介

MP175GS-Z 是 MPS 推出的一款高集成度非隔离开关控制与稳压器,内置 700V 功率晶体管,支持 9V~30V 工作电压范围,最大输出电流可达 600mA。器件兼容多种开关拓扑(降压、升压、降压-升压和反激式),提供主边(原边)反馈方案,适用于需要高集成度、体积受限且对隔离要求不高的电源设计。

二、主要规格

  • 是否隔离:非隔离
  • 工作电压:9V ~ 30V
  • 最大输出电流:600mA
  • 晶体管耐压:700V(内部开关)
  • 最大耗散功率 (Pd):1.64W
  • 工作温度范围:-40℃ ~ +125℃(结温 TJ)
  • 工作模式:连续导通模式(CCM)、断续导通模式(DCM)
  • 反馈方式:原边反馈(无需光耦)
  • 封装:SOIC-8
  • 保护功能:过热保护(OTP)、短路保护(SCP)、欠压保护(UVP)

三、关键特性与优势

  • 多拓扑支持:器件可在降压、升压、降压-升压及反激式拓扑中工作,便于在同一平台上实现不同输出电压/电流需求。
  • 高压内置开关:700V 耐压的内部晶体管适配高压侧设计,简化外围元件,缩小系统体积。
  • 原边反馈:避免使用光耦和次级环路,减小器件成本和装配复杂度,适合成本敏感的非隔离方案。
  • 完备保护:集成 OTP、SCP、UVP 提高系统可靠性,便于通过软件或少量外部器件实现过载与异常工况处理。

四、典型应用

  • 非隔离式 DC-DC 转换模块(输入 9~30V)
  • 汽车电子子系统(车载 12V/24V 总线侧电源)
  • 工业通讯与控制模块的局部电源
  • LED 驱动与便携式设备电源(在满足非隔离要求的场景下)

五、设计要点与热管理

  • 功耗与散热:器件 Pd 为 1.64W,设计时需评估 PCB 铜面积与散热路径,必要时在 SOIC-8 下方或周边增加散热铜箔。
  • 开关过冲抑制:700V 内部开关高速切换时需在外部加入 RC 吸收或钳位电路,配合合适的缠绕和布线以降低 EMI。
  • 输入/输出滤波:根据 CCM/DCM 工作点选择合适的电感与电容,注意输入侧去耦以保证稳定启动与抗干扰性能。
  • 原边反馈校准:利用原边辅助绕组或检测开关电流/电压完成反馈,需在设计时验证在不同负载与温度下的稳态精度。
  • 保护联动:建议在 PCB 上预留短路检测与热敏元件位置,配合器件内置保护实现分级保护策略。

六、封装与可靠性

MP175GS-Z 提供 SOIC-8 封装,适合自动化贴装工艺。器件在 -40℃ 至 +125℃ TJ 工作范围内,适配严苛环境要求。建议在最终产品验证阶段进行长期温升与过载测试,确认在实际散热条件下的可靠性。

总结:MP175GS-Z 以其高压内置开关、原边反馈与多拓扑兼容性,为非隔离电源设计提供了功能齐全且体积紧凑的解决方案。合理的散热与版图布局,以及对反馈与保护回路的调试,对发挥其最佳性能至关重要。

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