WMSIC Electronic Components

MPS MPM3811GG-Z

ModelMPM3811GG-Z
PackageQFN-10(2x2)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MPM3811GG-Z
Type
MPS
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPM3811GG-Z
Electronic Component
1
Electronic Component
2mm
Package
QFN-10(2x2)
Electronic Component
DC-DC Power Supply Module
Electronic Component
0.052g
Electronic Component
2mm
Electronic Component
1.6mm
Electronic Component
1
Features
Programmable Output Voltage
Type
Electronic Component
Electronic Component
BM0231120333
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPM3811GG-Z 产品概述

一、产品简介

MPM3811GG-Z 是一款小尺寸、高效率的降压型 DC-DC 转换器,适用于 2.3V 至 5.5V 输入电压范围,最高输出电流可达 1A。该器件采用 QFN-10 (2x2mm) 封装,厚度 1.6mm,集成开关晶体管与控制电路,工作开关频率为 2.4MHz,静态电流仅 340μA,转换效率最高可达 91%。器件具备过流保护、短路保护及过热保护等多重安全机制,工作温度范围为 -40°C 至 +125°C,适合便携式与空间受限的电源系统设计。

二、主要规格

  • 功能类型:降压型(同步稳压器)
  • 输入电压范围 Vin:2.3V ~ 5.5V
  • 输出电流(最大值):1A
  • 峰值/典型转换效率:最高可达 91%
  • 静态电流 Iq:340μA(轻载低功耗)
  • 开关频率:2.4MHz(固定)
  • 保护功能:过流保护(OCP)、短路保护(SCP)、过热保护(OTP)
  • 封装:QFN-10 (2x2mm),尺寸:长 2mm × 宽 2mm × 高 1.6mm
  • 工作温度:-40°C ~ +125°C
  • 品牌:MPS

三、关键特性与优势

  1. 高集成度与小体积:2×2mm QFN-10 封装,节省 PCB 面积,适合空间受限的移动设备及可穿戴终端。
  2. 高频工作:2.4MHz 开关频率允许使用更小的外部电感和陶瓷电容,减少整体方案体积并改善瞬态响应。
  3. 低静态电流:340μA 静态电流在待机或轻载条件下降低系统能耗,适合电池供电应用。
  4. 高效率:在常见负载条件下可达到约 91% 的转换效率,从而减少热量产生并提升电池续航。
  5. 完善的保护机制:内置 OCP、SCP 与 OTP,提升系统可靠性并简化保护电路设计。
  6. 宽输入电压范围:支持 2.3V 至 5.5V 的输入,兼容单节锂电池、双节或 USB 电源等多种供电来源。

四、典型应用场景

  • 便携式设备与移动终端(手持仪器、便携媒体)
  • 物联网设备与传感节点(边缘节点、智能传感器)
  • 可穿戴设备与健康监测产品
  • 工业与消费类嵌入式系统(需高密度电源方案)
  • 电池管理与系统供电子模块

五、设计注意事项与布局建议

  1. 输入与输出电容:推荐使用低 ESR 多层陶瓷电容(MLCC)靠近 VIN 与 GND 引脚放置,以降低输入纹波与环路噪声。输出侧同样优先采用 MLCC 以取得良好瞬态响应。
  2. 电感选择:2.4MHz 的开关频率适合采用小型低阻抗电感。针对 1A 负载,可从 0.47μH 至 1.0μH 范围内选择合适等级,需兼顾饱和电流和导通损耗。
  3. PCB 布局:将开关节点(SW)与功率回路缩短,输入电容靠近 VIN 与 GND 引脚,输出回路尽量使用较宽的铜箔以降低热阻与寄生阻抗。热量通过底部焊盘(PAD)与地平面传导,建议在 PCB 下方布置充足的散热铜箔。
  4. 电磁兼容(EMC):由于高开关频率,需在布局阶段控制环路面积并适当添加共模/差模抑制元件及屏蔽措施以降低辐射干扰。
  5. 启动与软启动:若需要限制启动浪涌,可采用外部软启动或在系统层面控制 EN/使能引脚(如器件提供)来平滑启动过程。

六、保护与可靠性

MPM3811GG-Z 内置过流保护,能在输出短路或过载时限制电流,减少器件及后端负载的损坏风险。短路保护响应及时,减少系统故障扩大;过热保护在器件温度异常升高时触发热关断,待温度恢复后允许自动或手动复位。建议在系统级加入必要的熔断或保险元件以提高整体安全性并满足应用场景的可靠性要求。

七、封装与机械信息

  • 封装类型:QFN-10 (2x2mm)
  • 尺寸:2.0 mm × 2.0 mm × 1.6 mm(含总高度)
  • 引脚数:10 引脚,典型引脚功能包括 VIN、GND、SW、FB、EN(或 SHDN)、BOOT 等(具体引脚排列与功能请参见详细数据手册)
  • 建议在 PCB 中为底部散热焊盘开辟适当的接地铜箔并配合过孔散热,提高散热效率。

八、选型与获取

MPM3811GG-Z 适合在对体积、效率与静态功耗有严格要求的便携与嵌入式电源设计中使用。最终设计前请参考 MPS 官方数据手册与典型应用电路,以获得完整的电气特性、典型电路、引脚定义与布局建议。如需样片或生产支持,建议通过官方代理商或授权分销渠道获取器件与技术资料。

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