WMSIC Electronic Components

MPS MP2651GVT-0000-Z

ModelMP2651GVT-0000-Z
PackageTQFN-30(4x5)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP2651GVT-0000-Z
Type
MPS
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP2651GVT-0000-Z
Electronic Component
1
Package
TQFN-30(4x5)
Electronic Component
Battery Management
Electronic Component
0.048g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0231120568
Operating Temperature
40℃~+125℃
Operating Voltage
4V~22V
Interface Type
I2C;SMBus
Battery
1~4
ICType
IC
Static Current(Iq)
550uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP2651GVT-0000-Z 产品概述

一、产品简介

MP2651GVT-0000-Z 是美信电源(MPS)推出的一款高集成度锂离子/聚合物电池充电管理芯片,适用于 1 ~ 4 节电池组的充电控制与电池监测。芯片工作电压范围宽(4V~22V),最大充电电流可达 6A,充电饱和电压设定为 4.67V,放电截止电压为 2.6V,可满足中高功率便携设备与工业应用对快速、安全充电的需求。器件以 TQFN-30(4×5mm)封装提供,支持电池温度检测并通过 I2C/SMBus 接口实现充电参数和状态的数字化监控与配置。

二、主要特性

  • 输入电压范围:4V~22V,适应多种供电场景(USB、适配器、车载等)。
  • 最大充电电流:6A,可满足大电流快充需求。
  • 充电饱和电压:4.67V(典型设定);放电截止电压:2.6V。
  • 支持 1~4 节锂离子/聚合物电芯配置。
  • 集成电池温度检测接口,支持温度相关的充电策略(热敏电阻或模拟温度传感)。
  • 静态电流(Iq):550μA,低待机损耗,有利于系统节能与长待机。
  • 通信接口:I2C / SMBus,便于系统主控读取实时状态、设定充电曲线或保护参数。
  • 工作温度范围宽:-40℃~+125℃,适合工业级温度环境。
  • 封装:TQFN-30(4×5mm),利于小型化设计与热散。

三、典型应用场景

  • 便携式电源与移动电源(Power Bank)
  • 智能手机、平板和可穿戴设备(需多节电池时)
  • 手持终端与工业仪表(要求高温与低温工作稳定性)
  • 电动工具与无人机(高放电/充电电流场景)
  • 车载电子与备用电源系统

四、电气性能与控制

MP2651GVT 提供精确的充电控制与数字化监测能力。通过 I2C/SMBus 接口,系统主控可读取电池电压、电流、温度及充电状态,并对充电电流、充电截止条件及安全参数进行配置。550μA 的静态电流在断电或待机模式下可降低系统能耗。实际可用充电电流受外部电源能力、PCB 热设计以及安全保护限制,应根据应用场景设定合适的充电曲线。

五、系统设计与注意事项

  • 热管理:6A 高电流工作时发热显著,需在 PCB 设计中做好热铜箔、散热通孔与器件底部散热垫(Exposed Pad)布局。
  • 输出与感测:建议将电流检测电阻(Rsense)与电池温度热敏元件靠近电池布置,降低测量误差。
  • I2C/SMBus:采用合适的上拉电阻并考虑总线速率与总线仲裁,确保主控与充电芯片通信稳定。
  • 电池兼容性:确认电芯化学类型与厂家建议的充电终止电压曲线一致,必要时通过数字接口调整参数。
  • 保护机制:配合外部或内部的过压、过流、短路及温度保护设计,保证电池与设备安全。

六、封装与可靠性

MP2651GVT-0000-Z 提供 TQFN-30(4×5mm)封装,利于空间受限的产品设计并兼顾散热。器件工作温度覆盖 -40℃~+125℃,适合多种工业与消费类使用环境。建议在 PCB 布局时优先考虑底部散热焊盘的焊接与热流路径,以提高长期可靠性。

七、总结

MP2651GVT-0000-Z 以其宽输入电压、支持高达 6A 的充电能力、1~4 节电池兼容性、I2C/SMBus 智能监控以及工业级工作温度范围,为需要高性能、高可靠性的充电管理系统提供了灵活且高集成的解决方案。在实际设计中应重点关注热管理、电流检测与数字通信的实现,以发挥芯片的最佳性能。

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