Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MA702GQ-Z
Configuration
1 options
Configuration
23+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- MPS MA702GQ-Z
- Type
- MPS
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MA702GQ-Z
- Electronic Component
- 1
- Electronic Component
- 3mm
- Package
- QFN-16(3x3)
- Electronic Component
- Electronic Component
- Type
- Magnetic positions Sensor
- Electronic Component
- positions Sensor
- Electronic Component
- 1g
- Electronic Component
- 3mm
- Electronic Component
- 1mm
- Electronic Component
- 1
- Features
- Magnetic;; Programmable; positions; Signal; Linear
- Electronic Component
- BM0192812653
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MA702GQ-Z 产品概述
概述
MA702GQ-Z 是一款由 Monolithic Power Systems Inc. (MPS) 生产的高性能霍尔效应角度传感器，采用先进的表面贴装技术（SMD）和高集成度封装。这款传感器专为各类精确角度测量应用而设计，特别适用于需要高可靠性和广泛工作温度范围的工业、汽车及消费电子产品。
关键特性
- 技术类型: 霍尔效应
- 输出信号: 脉宽调制（PWM）信号，具有可编程特性
- 额定供电电压: 3.3V
- 工作温度范围: -40°C 到 +125°C
- 封装类型: 16-VFQFN 裸露焊盘，适合表面贴装，尺寸为 3x3mm
- 安装类型: 表面贴装型（SMD）
应用场景
MA702GQ-Z 能够广泛应用于：
- 汽车电子: 适用于电动助力转向系统、角度定位控制及其他方向检测应用。
- 工业自动化: 在机器人和自动化设备中，提供精确的角位置信号。
- 消费电子: 用于各种智能设备中，提高人机交互的响应能力，比如游戏手柄和移动设备的方向传感。
性能优势
这款传感器采用霍尔效应原理，能够在各种环境条件下提供稳定的性能，特别是在高度动态的应用场景中，具备极好的抗干扰能力。PWM 输出信号可编程的特性，使得用户能够根据具体需求调节传感器的输出，这种灵活性在复杂系统中尤为重要。此外，超广的工作温度范围（-40°C ~ +125°C）确保了其在极端环境下的可靠运行，能够满足不同应用的需求。
封装与连接方式
MA702GQ-Z 配备了一个紧凑的 16-VFQFN 裸露焊盘封装。该封装不仅节省空间，还支持高密度安装，适合现代电子产品日益紧凑的设计要求。裸露焊盘设计有助于优化热管理，降低工作温度，从而提高传感器的整体性能和可靠性。
电气特性与接线
该传感器的工作电压为 3.3V，非常适合与现有的逻辑电平兼容的控制电路集成。在设计电路时，应注意提供稳定的供电，以确保测量精度。连接方式为 SMD（SMT）接片，设计时需考虑合适的 PCB 布局，以优化传感器性能和可靠性。
结论
MA702GQ-Z 是一款优质的角度传感器，凭借其出色的性能和灵活性，能够满足多种复杂应用的需求。无论是在高要求的工业场合，还是在对精度和响应速度有高要求的消费电子产品中，其优势均能得到充分发挥。MPS 通过不断推动技术进步，确保 MA702GQ-Z 在行业内的竞争力，使其成为角度测量解决方案的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
