WMSIC Electronic Components

MPS MP6543HGL-Z

ModelMP6543HGL-Z
PackageQFN-24(3x4)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MP6543HGL-Z
Type
MPS
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP6543HGL-Z
Electronic Component
1
Package
QFN-24(3x4)
Electronic Component
BLDC Motor Driver IC
Electronic Component
0.33g
Electronic Component
1
Integrated FET
Electronic Component
Features
Switch
Electronic Component
3
Electronic Component
BM0258839676
Current
9A
Operating Temperature
40℃~+125℃
Operating Voltage
3V~22V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP6543HGL-Z 产品概述

一、产品简介

MP6543HGL-Z 是美芯晟(MPS)面向小功率无刷直流电机(BLDC)控制的专用驱动芯片,适用于 PWM 控制场景。器件工作电压范围宽(PWM 输入/供电 3V ~ 22V),连续输出电流 2A,短时峰值电流可达 9A,能够满足小型驱动负载在启动和高速瞬态下的电流冲击需求。封装为 QFN-24 (3x4),适合紧凑板级布局并兼顾散热。

二、主要特性

  • 宽电压供电:支持 3V 至 22V 的工作电源范围,适配多种电池与直流电源。
  • 输出能力:持续驱动 2A 电流,峰值瞬时电流 9A(用于启动/堵转保护)。
  • 工业温度等级:工作温度 -40°C 至 +125°C,满足车规/工业级应用热裕度。
  • PWM 控制:兼容外部 PWM 信号,实现转速与力矩的精确控制。
  • 小型封装:QFN-24 (3x4) 有利于高密度 PCB 设计与系统体积优化。

三、保护与可靠性

芯片为现场应用考虑了多种保护机制,可在异常工况下提高系统可靠性(如过流保护、过温保护、欠压锁定等)。为保证长期可靠性,建议在设计时配合适当的电流检测与限流策略,并参考厂商数据手册中的热耗散与降额曲线进行设计。

四、典型应用场景

  • 无人机微型推进与云台驱动
  • 手持电动工具、玩具与小型机器人驱动
  • 机电阀门、微型泵与精密定位执行器
  • 机箱/笔记本冷却风扇、家用小电机驱动场合

五、PCB 布局与散热建议

  • QFN 封装需在 PCB 底部焊盘做良好散热设计:加大中央热焊盘面积并布置多排过孔直通底层铜箔,提高热导出能力。
  • 电源回路要尽量短且宽,电流回路(电源、电机至器件)使用大面积铜皮,减少寄生电感。
  • 在电源引脚与地之间靠近位置放置低 ESR 的旁路电容与大容量储能电容,滤除开关噪声与吸收瞬态电流。
  • 控制信号线与高电流回路应分离,采用星形接地或局部地平面以降低地弹返影响。

六、设计注意事项与选型建议

  • PWM 频率与死区时间需与电机特性匹配,避免过高频率导致开关损耗上升或过低频率产生噪音/振动。
  • 对于需要长持续高电流工作的场合,应参考器件热阻并进行降额设计,必要时采用外部散热措施或更高功率等级器件。
  • 购买与设计前请务必查阅原厂数据手册,确认引脚定义、典型应用电路与保护门限;如需快速验证,建议使用厂商评估板或参考设计。
  • 型号后缀(如 -Z)通常与包装/合规信息相关,选型采购时确认与项目封装与交付要求一致。

如需原厂详细规格、引脚图或参考电路,请查阅 MPS 官方数据手册或联系授权分销商获取评估板与技术支持。

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