WMSIC Electronic Components

MPS MP7770GF-Z

ModelMP7770GF-Z
Package28-TSSOP-EP
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MP7770GF-Z
Type
MPS
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP7770GF-Z
Electronic Component
1
Package
28-TSSOP-EP
Electronic Component
95%;90%;91%
Electronic Component
Audio Power Amplifier
Electronic Component
0.264g
Electronic Component
1
Power Amplifier Type
D Power Amplifier
Features
Switch;; Output
Electronic Component
BM0264926061
Operating Temperature
40℃~+125℃
Operating Voltage
9.5V~36V
Output Power
108Wx1@6Ω;41Wx2@4Ω
Static Current(Iq)
3mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP7770GF-Z 产品概述

一、产品简介

MP7770GF-Z 是 MPS 推出的一款高效 D 类音频功率放大器,提供单声道(1 通道,桥接输出)或双声道(2 通道,立体声)配置,封装为 28‑TSSOP‑EP。器件工作电压范围宽(9.5V 至 36V),适用于车载音响、便携音箱、家庭音频及主动低音炮等对效率与体积要求较高的应用。

二、关键电气参数

  • 输出功率:108W ×1 @6Ω(桥接单声道),41W ×2 @4Ω(立体声工作)
  • 总谐波失真 + 噪声(THD+N):0.03%(典型)
  • 静态电流(Iq):3mA(低待机功耗)
  • 电源纹波抑制比(PSRR):-60dB(优秀的电源噪声抑制)
  • 工作效率:最高可达 95%,典型工作模式下 90% 与 91% 等值
  • 工作温度范围:-40℃ 至 +125℃

三、功能特性

  • 自动静音 / 免噪音开关(pop‑free mute),减少开关瞬态噪音
  • 过压保护,提升系统可靠性并便于车载或工业电源使用
  • 可配置输出拓扑,支持桥接单声道或双通道立体声灵活切换
  • 低静态功耗,适合对待机能耗敏感的系统

四、封装与热管理

封装形式为 28‑TSSOP‑EP,带底部散热焊盘(EP),建议 PCB 布局时:

  • 在焊盘下方及周围使用多层大铜箔散热通道并与器件底部焊盘良好焊接
  • 靠近电源引脚放置足够的去耦电容(低 ESR);为保证 -60dB PSRR 与高效率运行,输入端建议并联陶瓷与薄膜电容
  • 在高功率输出场景下注意热限流与外部散热器,必要时进行降额设计以保证在 +125℃ 环境下长期可靠

五、典型应用场景

  • 汽车音响与娱乐系统(需宽电压和过压保护)
  • 便携式蓝牙音箱与家庭音频放大模块
  • 主动式低音炮与多声道合并放大器设计
  • 工业音频提示与公共广播系统

总结:MP7770GF-Z 集成高效率、低失真与完整保护特性,适合对功率密度与电源兼容性要求高的音频系统,灵活的输出拓扑与低待机电流使其在车载与消费类产品中具有较高的设计价值。若需具体电路图、典型应用原理图或 PCB 布局建议,可基于目标负载与散热条件进一步提供参考设计。

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