Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MPQ5073GG-AEC1-Z
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MPQ5073GG-AEC1-Z
- Type
- MPS
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MPQ5073GG-AEC1-Z
- Electronic Component
- 1
- Package
- QFN-12(2x2)
- Type
- Load Switch
- Electronic Component
- Power Electronic Switch
- Electronic Component
- 0.216g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Integrated Charge Pump; Output
- Electronic Component
- BM0258859735
- Resistor
- 50mΩ
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 500mV~5.5V
- Current
- 2A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MPQ5073GG-AEC1-Z 产品概述
MPQ5073GG-AEC1-Z 是 MPS 推出的一款高端单通道 P 通道电源开关/驱动器，适用于 0.5V 至 5.5V 的电源域。器件为 1:1（输入：输出）比率的高端开关，单输出设计，典型导通电阻仅 50 mΩ，最大输出电流 2A，集成受控压摆率与多重故障保护，适合对启动浪涌、热管理和短路防护有要求的系统。
一、主要特性
- 开关类型：通用高端开关（P 通道）
- 比率（输入:输出）：1：1
- 输出数：1 路
- 输出电流：最大 2A
- 导通电阻（典型值）：50 mΩ
- 工作电压（负载与供电）：0.5V ~ 5.5V
- 输入类型：CMOS 逻辑兼容
- 特性：压摆率受控（限制上电/关断冲击）
- 故障保护：过温保护、短路保护
- 工作结温范围：-40°C ~ 125°C（TJ）
- 封装/安装：12‑QFN（2x2）裸露焊盘，表面贴装
二、器件功能与优势
MPQ5073GG-AEC1-Z 将低导通损耗与受控开关速度结合，既能在导通状态下减少功率损耗，又能通过可控的压摆率抑制上电突变导致的输入电流浪涌，保护下游元件与供电网络。内置短路与过温保护提高系统可靠性，在异常条件下限制电流并保护器件自身。
三、典型应用场景
- 电源管理与电源域切换（电源选择、高端开关）
- 嵌入式系统和便携设备的上电浪涌控制
- 汽车电子与工业控制（型号后缀 -AEC1 指向汽车级应用，可在高可靠性场景评估）
- 通信设备、摄像头模组、FPGA/SoC 的电源隔离与保护
四、设计与使用建议
- 布局：裸露焊盘用于散热，建议与铜箔焊盘良好连接并加多个过孔引至内层或底层散热区域，最小化功率沉积点的温升。
- 去耦与滤波：VCC/VDD 端建议近引脚放置低 ESR 电容以稳定供电并抑制开关瞬态。
- 热设计：在 2A 工作情况下，注意依据实际 RDS(on) 与系统环境温度计算功耗并进行散热管理，避免触发过温保护。
- 信号接口：输入为 CMOS 兼容，逻辑电平需在器件电源范围内（0.5V~5.5V）正确驱动，以确保稳定开关性能。
- 保护验证：在系统级验证中测试短路与过温触发行为，确认恢复模式与时间满足系统需求。
五、封装与环境指标
器件采用 12‑引脚 VFQFN（2x2mm）裸露焊盘封装，适合高密度表贴应用。额定工作结温 -40°C 至 125°C，适配宽温度工作环境。实际布局时请参照官方封装与焊盘建议，确保焊接可靠性与热路径优化。
六、选型与注意事项
MPQ5073GG-AEC1-Z 适用于需要低导通损耗、受控上电和故障保护的高端开关应用。选型时应确认最大持续电流、RDS(on) 引发的功耗与系统散热能力匹配；同时如需符合特定汽车级认证（AEC‑Q100 等），请参考厂商完整数据手册与认证文件。建议获取并阅读官方 Datasheet 以确认引脚分配、时序参数和保护行为的具体细节。
如需原理图示例、热仿真建议或与替代器件对比，可提供更多系统信息以便给出更具体的设计支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
