Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MPS MP2321GD-Z
Configuration
1 options
Configuration
21+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MPS MP2321GD-Z
- Type
- MPS
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MPS
- Electronic Component
- MP2321GD-Z
- Electronic Component
- 1
- Package
- QFN-14(2x3)
- Electronic Component
- DC-DC Power Supply IC
- Electronic Component
- 0.106g
- Electronic Component
- 1
- Features
- Built-in LDORegulator
- Type
- Electronic Component
- Synchronous
- Electronic Component
- Electronic Component
- BM0058432934
- Operating Temperature
- 40℃~+125℃@(TJ)
- Operating Voltage
- 4V~19V
- Switching Frequency
- 500kHz~1.1MHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MP2321GD-Z 产品概述
一、产品简介
MP2321GD-Z 是 MPS 推出的降压型同步整流开关稳压器，采用降压（buck）拓扑并集成开关管，适用于 4V～19V 宽输入电压系统。器件提供可调输出 0.6V～19V，最大输出电流 2A，静态电流仅 40μA，典型开关频率范围为 500kHz～1.1MHz。芯片封装为 QFN-14 (2×3)，工作结温范围 -40℃～+125℃，针对便携、车载与工业级应用在效率、尺寸与保护方面进行了优化。
二、主要特性
- 输入电压：4V ～ 19V
- 输出电压：可调 0.6V ～ 19V
- 最大输出电流：2A（同步整流，提高效率）
- 开关频率：500kHz ～ 1.1MHz（高频利于小型磁件）
- 低静态电流：Iq ≈ 40μA（节省待机功耗）
- 内置功率开关（无需外置功率管）
- 功能特性：轻载高效模式、内置 LDO 稳压器、逐波限流（cycle-by-cycle）、可调软启动、过流保护、打嗝限流（hiccup）、工作状态指示
- 封装：QFN-14 (2×3)，MPS 品牌
三、典型应用场景
- 车载电子（辅助电源、仪表、摄像头）
- 工业控制与通信设备的点电源
- 便携式设备与电池供电系统的高效降压方案
- 需要低待机功耗的物联网终端与传感器供电
四、设计要点与布局建议
- 电感：选择饱和电流大于 2A 的低 DCR 电感，感值根据所需输出纹波与占空比设计；高频工作有利于减小体积。
- 输入/输出电容：优先使用低 ESR 多层陶瓷电容（MLCC），输入端建议靠近 VIN 与 GND 布局以抑制开关噪声，输出端容量与 ESR 配合满足瞬态响应。
- 软启动：利用外部可调软启动功能限制启动浪涌，保护输入与负载；软启动时间根据系统需求调整。
- PCB 布局：输入回路（VIN、PGND、输入电容）布线尽量短且宽；功率回流路径最短化；热量通过底部散热垫与多层铜箔扩散。
- 热设计：在高输入、满载工作下需注意功率耗散与结温，必要时增加铜面积或散热片。
五、保护与可靠性
MP2321GD-Z 集成多重保护机制：逐波限流提供快速电流限制以防止短路瞬态，打嗝限流在持续故障时实现周期性重试以降低功耗并保护器件；可调软启动防止启动时的电流冲击。工作状态指示可用于系统级故障诊断与上位机管理。
六、封装与选型建议
- 封装：QFN-14 (2×3)，适合紧凑型电源模块设计。
- 选型建议：若系统需更高电流或更低压降，可考虑 MPS 的其他更高功率器件；在设计中匹配合适的电感与电容以保证稳定性与效率。
总结：MP2321GD-Z 提供宽输入、高效率、低静态电流的单通道降压解决方案，集成多项保护与实用功能，适合对体积、功耗与可靠性有较高要求的嵌入式与车载应用。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
