WMSIC Electronic Components

MPS MPM3650GQW-Z

ModelMPM3650GQW-Z
Package24-Power LFQFN Module
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MPM3650GQW-Z
Type
MPS
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPM3650GQW-Z
Electronic Component
1
Electronic Component
4mm
Package
24-Power LFQFN Module
Electronic Component
DC-DC Power Supply Module
Electronic Component
0.43g
Electronic Component
6mm
Electronic Component
1.6mm
Electronic Component
1
Features
Programmable Output Voltage; Programmable
Type
Electronic Component
Electronic Component
BM0264890185
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPM3650GQW‑Z 产品概述

一、概述

MPM3650GQW‑Z 是一款高集成度的降压型同步开关稳压器,工作开关频率为1.2MHz,输入电压范围2.75V至17V,输出电压可编程在600mV至12V之间,最大输出电流6A。器件静态电流仅约100μA,适合对待机功耗敏感的应用;工作温度范围为‑40℃到+125℃。器件以24引脚Power LFQFN模块形式封装(尺寸6.0×4.0×1.6 mm),适合高密度点对点电源设计。

二、核心特性

  • 高集成:同步整流结构,集成高侧/低侧开关,外部元件数量少。
  • 高频率:1.2MHz 开关频率,有利于减小外部电感和电容体积,缩小 PCB 占用。
  • 宽输入范围与宽输出可调:输入2.75–17V,输出0.6–12V,满足多种系统需求。
  • 低静态电流:100μA,轻载或待机时功耗低。
  • 全保护功能:短路保护、欠压保护、过流保护、过热保护及自动故障恢复。
  • 可编程功能:可编程输出电压、可编程软启动并支持上电时序控制与轻载高效模式。

三、优势与适用场景

该器件适用于通信设备、嵌入式主板、工业控制、电源管理模块和电池供电系统的点对点降压供电。高效率与高频率结合小体积封装,适合空间受限且需快速瞬态响应的场合;低静态电流使其也适合低功耗或待机场景。

四、设计要点与布局建议

  • 输入电容:靠近Vin引脚放置低ESR陶瓷电容以抑制尖峰与减小纹波。
  • 输出滤波:根据输出电流选择合适电感(考虑饱和电流)与低ESR输出电容以保证稳定性与低纹波。
  • 散热与布局:裸露散热焊盘接地并做足铜面,器件热阻依赖PCB铜箔面积,需预留散热通道。
  • 开启与软启动:利用软启动与上电时序引脚避免浪涌与保证系统电源排序。
  • 布线要点:功率环(Vin、SW、Cout、GND)应尽量短且成回路,减少寄生电感。

五、可靠性与保护

内建短路、欠压、过流与过温保护,支持故障自动恢复,提升系统可靠性并简化外部保护电路设计。工作温度范围广,适合工业级应用。

六、封装与采购信息

器件为MPS品牌,24‑Power LFQFN模块封装,尺寸6.0×4.0×1.6 mm,便于高密度组装。建议在设计初期参考厂家数据手册和参考设计布局,以确保性能与散热满足目标应用需求。

如需更具体的典型应用电路、外部元件选型或热仿真建议,可提供目标工况(输入/输出电压、峰值电流与工作频率要求),以便给出更精确的设计方案。

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