WMSIC Electronic Components

MPS MPM3695GRF-25-0022

ModelMPM3695GRF-25-0022
PackageQFN-59(10x12)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
MPS MPM3695GRF-25-0022
Type
MPS
Unit
Electronic Component
Minimum package
210 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPM3695GRF-25-0022
Electronic Component
1
Electronic Component
12mm
Package
QFN-59(10x12)
Electronic Component
DC-DC Power Supply Module
Electronic Component
1.65g
Electronic Component
10mm
Electronic Component
4mm
Electronic Component
1
Features
Programmable Output Voltage; Programmable;;;; Sampling
Electronic Component
BM0264891260
Operating Temperature
40℃~+125℃
Switching Frequency
600kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPM3695GRF-25-0022 产品概述

MPM3695GRF-25-0022 是 MPS 面向中高功率点对点与板载供电应用设计的单通道降压开关稳压器。该器件覆盖宽输入电压和宽输出电压范围,并具备高达 20A 的输出能力与完善的保护与可编程功能,适合为 FPGA、处理器、通信模块、存储器和高性能电源管理子系统提供高效、稳定的电源。

一、主要规格一览

  • 输出通道数:1
  • 输入电压范围 (Vin):3V ~ 16V
  • 输出电压范围 (Vout):0.5V ~ 5.5V(可编程)
  • 输出电压精度:±1%
  • 最大输出电流:20A
  • 静态电流(quiescent current):2.5mA
  • 开关频率:600kHz
  • 工作温度范围:-40℃ ~ +125℃
  • 尺寸:10mm × 12mm × 4mm
  • 品牌:MPS
  • 封装:未知(请以官方资料为准)
  • 功能特性:轻载高效模式、可编程输出、可编程软启动、过流/欠压/过压/过热保护、远端采样补偿

二、功能与性能亮点

  1. 宽输入与可编程输出:器件支持 3V16V 的输入,输出电压可在 0.5V5.5V 范围内编程,适配多种数字电路和模拟负载的供电需求。
  2. 高电流能力:最高 20A 输出能力,可满足高性能 SoC、FPGA 或多路负载的供电要求。
  3. 精准电压调节:典型输出精度 ±1%,结合远端采样补偿(remote sense),可在负载线压降存在时实现端点电压精准控制。
  4. 轻载高效模式:在轻载或待机条件下自动进入高效率工作模式(节能模式),降低静态功耗,同时在负载上升时迅速恢复正常调制以保证瞬态响应。
  5. 多重保护:器件内建可编程软启动以及欠压保护(UVP)、过压保护(OVP)、过流保护(OCP)与过热保护(OTP),提高系统可靠性并简化保护策略实现。

三、热管理与布局建议

  • 由于器件支持 20A 输出,热耗散是设计时的关键考虑点。建议在 PCB 上提供充足的散热铜箔,并在功率回路(输入电容、开关节点、输出电感与输出电容)周围保持短且宽的走线以降低寄生电阻与热集中。
  • 内部开关频率为 600kHz,采用中等频率可在尺寸与效率间取得平衡;配合低 ESR 输出电容与合适的闭环补偿,可获得良好的瞬态性能。
  • 如器件封装带有底部散热片/焊盘,请确保与 PCB 地平面有良好焊接以便传导热量。

四、外围元件与设计注意事项

  • 输入电容:选择低 ESR、耐压高于最大输入电压的陶瓷或钽电容,置于 VIN 与 GND 最近处以抑制开关噪声与输入纹波。
  • 输出电容与电感:按照所需输出电流与纹波规范选择输出电感与多颗并联低 ESR 电容,保证稳定性与低输出纹波;远端采样时注意采样点接线避免环路干扰。
  • 软启动与补偿:可编程软启动用于限制启动电流和避免输出超调;遵循制造商推荐的补偿网络与走线方式以保持稳定的闭环性能。
  • 布局:开关回路尽量缩短,感性回流路径和开关节点用铜皮覆盖;模拟地与功率地分区后在单点汇流,采样地与参考地处理要谨慎。

五、典型应用场景

  • FPGA/ASIC/VPU/SoC 的主供电或核心电压(需要高精度与远端采样补偿)
  • 通信与基站电源模块
  • 存储器供电(DRAM、LPDDR)
  • 工业控制与汽车电子(工作温度范围支持较宽环境)
  • 高性能单板与多电压轨供电子系统

六、可靠性与系统集成建议

在系统集成时,建议参考 MPS 官方数据手册获取完整的电气特性曲线、典型应用电路与 PCB 布局范例。对高功率、长时间运行或工作在高温环境下的应用,需进行热仿真与长期应力测试,验证器件在最大负载与环境温度下的稳定性与寿命。

注:本文基于给定参数对 MPM3695GRF-25-0022 的功能与应用进行概述。封装引脚、具体外围元件数值与完整特性曲线请以制造商最新数据手册为准。

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