WMSIC Electronic Components

MPS MPL-AT2512-100

ModelMPL-AT2512-100
Package1008
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MPS MPL-AT2512-100
Type
MPS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MPL-AT2512-100
Electronic Component
1
Package
1008
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.31g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0259535890
Current
1.2A
Resistor(DCR)
355mΩ
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MPL-AT2512-100 功率电感器产品概述

一、产品简介

MPL-AT2512-100 为 MPS 推出的表面贴装模制功率电感器,标称电感量 10 µH,尺寸为 2.50 mm × 2.00 mm(常称 1008 封装),最大安装高度 1.20 mm。器件为无屏蔽结构,适用于空间受限的电源和滤波场合,工作温度范围 -40°C 至 +125°C,侧重于小体积与中等电流能力的折衷设计。

二、主要电气参数

  • 电感量(标称):10 µH(测试频率 100 kHz)
  • 饱和电流(Isat):1.7 A(磁通密度降至额定值前的最大直流电流)
  • 额定电流(Irated):1.2 A(长期允许通过、并满足温升与性能要求的电流)
  • 直流电阻(DCR):典型 355 mΩ(影响功率损耗与温升)
  • 屏蔽:无屏蔽(磁通外泄较大,布局需注意对周边敏感器件的干扰)
  • 封装/安装:SMD,模制封装,1008(2.50 × 2.00 mm),最大总高 1.20 mm

三、特点与优势

  • 小尺寸封装适合密集布局的移动设备、便携电源和点-of-load(POL)模块。
  • 中等电流能力(Irated 1.2 A / Isat 1.7 A)满足多数轻载至中载降压型 DC–DC 转换器与电源滤波要求。
  • 模制结构提高机械强度与焊接可靠性,适应自动贴片与回流焊工艺。
  • 无屏蔽设计使得磁通密度较高场合可获得较好的电感密度,但需在布板时考虑磁干扰抑制。

四、典型应用场景

  • 小功率降压(buck)转换器和点-of-load 电源模块
  • 输入/输出滤波(电源去耦、LC 滤波器)
  • 手持设备、便携式仪器的电源管理
  • 工业与通信设备中的局部电源及噪声抑制场合

五、选型与使用建议

  • 电流裕量:为避免进入饱和区并限制电感下降,设计时建议将最大工作电流限制在 Irated(1.2 A)以下,若存在短时冲击电流,应比较 Isat(1.7 A)并预留足够裕量。
  • 损耗与热管理:DCR 为 355 mΩ,电流平方乘以 DCR 将在器件上产生显著功率损耗与温升;频繁高电流或高占空比工况下需评估温升并适当降额或加强散热。
  • 布局:由于无屏蔽结构,建议将电感与敏感模拟电路保持一定距离;在开关电源中,尽量靠近开关器件或功率 IC 放置以减小寄生环路面积,改善 EMI。
  • 焊接:采用标准无铅回流焊工艺,参考 JEDEC/IPC 回流曲线进行工艺优化,避免过高峰值温度与重复加热。
  • 测试条件:标称电感在 100 kHz 测得,实际工作频率与直流偏置电流会影响有效电感,应在目标工况下验证。

六、包装与采购信息

  • 品牌:MPS
  • 型号:MPL-AT2512-100
  • 封装:1008(2.50 × 2.00 mm SMD)
  • 典型用途:电源滤波、DC–DC 转换器电感

选购时请关注器件的实际电感容差与测试条件、完整数据手册中的频率响应、热阻以及在不同直流偏置下的电感衰减曲线。如需在高温、高振幅或靠近敏感模拟模块的环境中使用,建议向厂商索取更详尽的性能曲线或进行样品实测验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.