WMSIC Electronic Components

MPS MP3422GG-Z

ModelMP3422GG-Z
PackageQFN-14(2x2)
BrandMPS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 138437

Availability on request

Technical data

Product details

20 specifications

Core information

Product name
MPS MP3422GG-Z
Type
MPS
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MPS
Electronic Component
MP3422GG-Z
Electronic Component
1
Package
QFN-14(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.087g
Electronic Component
1
Features
Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0000287082
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
1.9V~5.5V
Switching Frequency
600kHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MP3422GG-Z 产品概述

一、概述

MP3422GG-Z 是一款高性能的升压开关稳压器集成电路(IC),专为需高效能与高输出电流的应用而设计。其拓扑结构为升压(Boost)式,具有单输出可调型特性,可广泛应用于便携式设备、消费电子及工业设备中,用来满足多样化的电源需求。

二、主要特点

  1. 升压功能:MP3422GG-Z 提供了有效的升压能力,能够将输入电压从1.9V 提升至高达5.5V 的输出电压。这使其非常适合用于需要高输出电压但输入电压较低的场合。

  2. 输出电流能力:其开关输出电流高达6.5A,能够满足大功率负载的需求,确保设备在不同负载情况下均可稳定运行。

  3. 高效率与低功耗:该IC内置同步整流器,能够显著提高电源转换效率,降低功耗,适合对能效有严格要求的应用。

  4. 频率特性:MP3422GG-Z 的开关频率为600kHz,使其在保持高效率的同时,缩小了外部元件的体积,从而支持更小型的设计。

  5. 宽输入电压范围:支持的输入电压范围从1.9V到5.5V,为设计师提供了更大的灵活性,能够兼容多种电池和电源解决方案。

  6. 封装与安装:此IC采用14-PowerVFQFN(2x2mm)表面贴装型封装,适合紧凑型设计,易于集成至各种电路板。

  7. 广泛的工作温度范围:MP3422GG-Z 在-40°C至125°C的范围内稳定工作,确保了其在高温及极端环境下的可靠性。

三、应用领域

MP3422GG-Z 由于其优越的性能特点,被广泛应用于以下领域:

  • 便携式电子设备:如智能手机、平板电脑,以及各种可穿戴设备,满足便携设备日益增加的电源需求。
  • LED驱动:在LED照明和显示设备中,该IC能够提供稳定的驱动电压,从而确保LED的亮度一致性。
  • 工业控制系统:用于提供可靠电源的工业设备,如传感器、电机驱动器等。
  • 通信设备:提升低电压信号的供电能力,为现代通信设备提供稳定的工作环境。

四、设计注意事项

在使用 MP3422GG-Z 设计电路时,设计师需考虑以下几点:

  1. 外部元件的选取:为了优化性能,外部电感、电容和二极管等需要根据设计需求进行选择,以确保系统的稳定性和可靠性。

  2. 散热管理:在高电流输出条件下,IC的热管理至关重要,建议设计适当的散热方案以避免过热。

  3. PCB布局:合理布局 PCB,以减少电流环的影响,确保电源的稳定性和降低 EMI(电磁干扰)问题。

  4. 负载变化:监测负载变化对输出电压的影响,必要时可考虑添加反馈控制机制,以维持输出电压的稳定。

五、总结

总的来说,MP3422GG-Z 是一款高度集成的升压开关稳压器 IC,凭借其高输出电流、高效率及宽输入电压范围,成为了广泛电源管理应用的理想选择。其在手持设备、LED 驱动、工业控制和通信等领域中的应用,使其在现代电子设计中具有重要的价值。设计师可通过充分利用其特性,为客户提供更高效、可靠的电源解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.