WMSIC Electronic Components

MSKSEMI MSESDAVLC6V1-1BM2 MSESDAVLC6V1

ModelMSESDAVLC6V1-1BM2
PackageSOD-882
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI MSESDAVLC6V1-1BM2
Type
MSKSEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
MSESDAVLC6V1-1BM2
Electronic Component
1
Package
SOD-882
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
8pF
Electronic Component
BM0264464027
Voltage
12.5V
Electronic Component
IEC 61000-4-2
Current(Ir)
500nA
Voltage(VBR)
8V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSESDAVLC6V1-1BM2 产品概述

一、产品简介

MSESDAVLC6V1-1BM2 是美森科(MSKSEMI)推出的一款用于高速信号线和接口的表面贴装型ESD/瞬态抑制二极管。器件针对工作电压为 6V 的电路进行优化,能在发生静电放电或短时脉冲干扰时迅速钳位,有效保护后端敏感器件和接口电路,常用于移动终端、摄像模组、USB/TTL 接口、消费电子与物联网设备等场景。

二、主要电气参数

  • 工作电压(VRWM):6 V
  • 击穿电压(VBR):5.6 V ~ 8 V(典型值约 8 V)
  • 钳位电压(VCL):12.5 V(在脉冲条件下测得)
  • 峰值脉冲电流(IPP):5.5 A
  • 峰值脉冲功率(Ppp):70 W(8/20 µs 波形)
  • 持续功耗(PD):300 mW(静态条件下)
  • 反向漏电流(IR):500 nA(在 VRWM 下)
  • 结电容(Cj):8 pF(低电容设计,适合高速信号)
  • 防护标准:符合 IEC 61000-4-2 静电放电保护要求
  • 封装:SOD-882(小型 SMD 方案)

三、产品特点

  • 低电容(8 pF):对高速信号的影响小,适合数据线与高频接口保护。
  • 高瞬态能量吸收能力:70 W(8/20 µs)和 5.5 A 峰值脉冲电流,能承受常见的静电放电和短时干扰脉冲。
  • 低漏电:500 nA 的反向漏电控制,有利于对低功耗电路和模拟前端的影响最小化。
  • 紧凑封装(SOD-882):占板面积小,适合空间受限的移动与便携式设备。
  • 符合工业级 ESD 标准:满足 IEC 61000-4-2 要求,可靠性高。

四、典型应用

  • 手机、平板等移动终端的外部接口(如耳机、充电与数据口)保护
  • 摄像头模组、图像传感器接口保护
  • USB、HDMI、UART、I2C 等高速或低电压信号线的浪涌和静电防护
  • 智能家居、IoT 传感器节点的输入/输出引脚保护
  • 任何工作电压接近 6V 的敏感电路保护场合

五、设计与布局建议

  • 将器件尽量靠近被保护的接口或引脚布局,缩短走线以减小寄生感抗和延迟。
  • 对地连接应采用多径短距离等低感抗布局,必要时使用过孔将地线尽快引至系统地平面。
  • 对于更高能量的环境,建议与串联阻抗(如系列电阻或共模电感)配合使用,以分担能量和改善钳位表现。
  • 在差分或双向信号线上使用时,请根据线路特性选择合适的器件拓扑(单向/双向),并确认器件极性与信号要求匹配。

六、注意事项与限制

  • 本器件用于吸收短时脉冲与静电放电,不适合作为直流持续大电流载流器,应避免长期超出 PD 和 IR 规格的工作状态。
  • 钳位电压与实际保护电压与脉冲形状、线路阻抗、寄生电感有关,实际应用中应通过仿真与实测验证钳位能力。
  • 若需更高雷击或浪涌保护能力,应配合更大功率的 TVS 或多级保护方案。

七、封装与品牌信息

  • 品牌:MSKSEMI(美森科)
  • 型号:MSESDAVLC6V1-1BM2
  • 封装:SOD-882,适合自动贴装生产

总结:MSESDAVLC6V1-1BM2 以其低电容、高脉冲能量吸收能力和小型封装,适合保护工作电压为 6V 的高速接口与敏感引脚,是移动设备与消费电子中常用的 ESD 防护元件。正确的PCB布局与配套措施可进一步提升系统抗扰度与可靠性。若需更详细的典型电流-电压曲线、钳位特性测试条件或器件等级认证信息,可参考厂商完整数据手册或联系供应商获取样片与评估报告。

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