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MSKSEMI SMBJ22A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI SMBJ22A
- Type
- MSKSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- SMBJ22A
- Electronic Component
- 1
- Package
- SMB(DO-214AA)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.2g
- Electronic Component
- 1
- Electronic Component
- BM0229210845
- Voltage
- 35.5V
- Current(Ir)
- 1uA
- Voltage(VBR)
- 26.9V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMBJ22A（MSKSEMI）产品概述
一、产品简介
SMBJ22A 是美森科（MSKSEMI）提供的一款单向瞬态电压抑制器（TVS），封装为 SMB（DO-214AA）。其主要电气参数：反向截止电压 Vrwm = 22V，击穿电压 VBR ≈ 26.9V，钳位电压 Vc ≈ 35.5V（在额定浪涌条件下），峰值脉冲电流 Ipp = 16.91A（10/1000μs 波形），峰值脉冲功率 Ppp = 400W（10/1000μs），静态反向漏电流 Ir ≈ 1μA。该器件用于瞬态浪涌抑制、过压保护，适合中等能量冲击防护场合。
二、主要特性
- 单向结构，适用于直流或单向浪涌工况；
- 低静态漏电流（≈1μA），对待机电流影响小；
- 高能量吸收能力（400W@10/1000μs），可承受雷击或开关浪涌；
- 钳位电压相对较低（35.5V），能有效限制被保护电路电压尖峰；
- SMB 封装便于自动贴装与散热。
三、关键参数说明
- Vrwm（反向截止）：器件在不触发时可长期承受的最大反向工作电压，本品为22V；
- VBR（击穿）：在指定电流下开始导通的电压，约26.9V；
- Vc（钳位）：在指定浪涌电流下的电压峰值，用以衡量保护能力；
- Ipp、Ppp：按10/1000μs 波形定义的浪涌电流与功率吸收能力，适合雷击后续能量特性。
四、典型应用
- 24V 工业控制与自动化设备电源线路保护；
- 开关电源输出侧与输入侧的浪涌抑制；
- 通讯设备和基站的直流母线保护；
- 消费类电子和电源模块的进线过压保护。
五、封装与安装建议
SMB（DO-214AA）为表面贴装封装，安装时应靠近需保护端口或连接器，缩短回路路径以降低感抗。建议使用宽铜箔散热并设计适当的焊盘和热孔，以利于热量传导与脉冲能量分散。
六、选型与使用注意
- 系统工作电压应低于 Vrwm，并留有裕量；被保护器件的最大承受电压应高于钳位电压；
- 对频繁或高能量冲击场合，考虑更高 Ppp 级别或外配熔断元件；
- 并联 TVS 可增加能量承受，但需考虑匹配与散热问题；
- 使用前请参照完整数据手册，关注功率谱、脉冲重复率与温度漂移特性。
七、可靠性与测试
建议按 IEC/ITU 等相关浪涌试验标准（如 10/1000μs 浪涌）进行实际验证。长期可靠性受峰值能量、环境温度和焊接工艺影响，合理的 PCB 散热与保护电路可延长寿命。
八、结论
SMBJ22A 提供了面向中等能量浪涌的高性价比保护方案，低漏电、高钳位抑制能力和 SMB 封装使其在工业电源、通信与消费电子中具有广泛适用性。选型时务必结合系统工作电压、允许钳位电压及预期浪涌能量进行综合评估，并遵循良好 PCB 布局与热管理实践。
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