WMSIC Electronic Components

MSKSEMI SMF3.3A

ModelSMF3.3A
PackageSOD-123FL
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI SMF3.3A
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
SMF3.3A
Electronic Component
1
Package
SOD-123FL
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.04g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0219847967
Voltage
8V
Current(Ir)
200uA
Voltage(VBR)
6V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MSKSEMI SMF3.3A

在现代电子设计与应用中,选择合适的元器件对于系统的性能、效率及可靠性至关重要。MSKSEMI(美森科)作为一家领先的电子元器件制造商,提供多种高性能组件,其中SMF3.3A是其一款备受关注的稳压二极管产品,以下将对其进行详细的概述。

1. 产品基本信息

产品名称: SMF3.3A
品牌: MSKSEMI
封装类型: SOD-123FL
最大稳压值: 3.3V
最大反向电流: 1A(typical)
工作温度范围: -55°C 至 +150°C

2. 产品特性

SMF3.3A稳压二极管设计为小型化的SOD-123FL封装,这种封装不仅具有良好的热导性和电气性能,还具有较小的外形尺寸,便于在空间受限的设计中使用。该产品主要特性包括:

  • 稳压性能: SMF3.3A能够提供稳定的3.3V输出电压,适用于需要恒定电压的应用,这对于低功耗电子设备尤为重要。
  • 高功率处理能力: 产品支持最高1A的反向电流,使其能够满足多种应用的需求,从而增强系统的可靠性与稳定性。
  • 宽工作温度范围: 得益于其优良的材料选择,该稳压二极管能够在-55°C至+150°C的极端温度条件下工作,适用于严苛的环境。
  • 低漏电流: 该元器件在稳压工作的情况下漏电流较低,有利于提升电源效率。

3. 应用场景

SMF3.3A稳压二极管广泛应用于多个领域和场景,主要包括:

  • 消费电子: 在手机、平板电脑等消费电子产品中,SMF3.3A可用作电源管理,确保设备在不同工作条件下提供一致的3.3V电压。
  • 工业控制系统: 在复杂的工业自动化控制中,可靠的电源稳压对于系统的安全和稳定运行至关重要,SMF3.3A能够保证设备稳压工作。
  • 通信设备: 通信设备在传输数据时,需要稳定的电压供电,SMF3.3A能够有效降低噪声,提高信号的稳定性。
  • 汽车电子: 随着新能源汽车的兴起,稳压二极管在汽车电子系统中的应用逐渐增多,SMF3.3A可以适应各种汽车中电源管理系统的需求。

4. 整体优势

选择SMF3.3A作为稳压解决方案,设计师将获得多个优势:

  • 提高设备性能: 通过提供稳定的电压,SMF3.3A能够减少电源波动对电子元器件的影响,提升系统的整体性能。
  • 节省空间: SOD-123FL的小型封装在保证性能的同时,有效节省了电路板的空间,便于集成更多功能。
  • 增强系统可靠性: SMF3.3A具备优良的温度稳定性与抗干扰能力,使得其在长时间运行时,依然能保持良好的性能,降低故障率。

5. 总结

MSKSEMI的SMF3.3A稳压二极管凭借其优良的电气特性、广泛的适用场景及可靠的工作性能,成为市场中备受青睐的选择。无论在消费电子、工业控制、通信设备还是汽车电子领域,SMF3.3A都能提供可靠的解决方案,为电子设备的稳定运行提供保障。对于设计师而言,选择SMF3.3A不仅仅是选择了一款元器件,更是为整个设计提供了性能与可靠性的提升。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.