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MSKSEMI MS2A40LWS
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI MS2A40LWS
- Type
- MSKSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- MS2A40LWS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0226270622
- Current
- 2A
- Diode
- 1
- Current(Ir)
- 80uA@40V
- (Vf)
- 370mV@1A
- Electronic Component
- 50℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MS2A40LWS 产品概述
一、产品简介
MS2A40LWS 是美森科（MSKSEMI）推出的一款小尺寸肖特基整流二极管，采用 SOD-323 封装，专为高频开关电源、功率管理和保护电路设计。器件在常见工作温度范围（-50℃ 至 +125℃）内稳定工作，具备低正向压降与快速恢复特性，适合在空间受限且要求高效率的场景替代普通硅整流二极管。
二、主要电气参数
- 额定直流正向电流（整流电流）：2A（连续）
- 正向电压 Vf：约 370mV @ 1A（典型）
- 直流反向耐压 Vr：40V
- 反向漏电流 Ir：80μA @ 40V
- 非重复峰值浪涌电流 Ifsm：20A
- 工作结温：-50℃ ~ +125℃
这些参数表明 MS2A40LWS 在 1A 以下工作时具有极低的导通损耗，短时能够承受较高浪涌电流，适用于整流、钳位与保护用途。
三、产品特点与优势
- 低正向压降：在中低电流区（如数百毫安至 1A）表现出较低的 Vf，能显著降低功耗和发热，提高整体效率。
- 快速响应与肖特基特性：无明显反向恢复峰值，适合高频开关环境，减少电磁干扰和交叉导通风险。
- 紧凑封装：SOD-323 小型外形便于在密集 PCB 布局中节省空间，利于便携设备与移动电源等应用。
- 良好浪涌承受能力：20A 非重复峰值浪涌电流满足启动冲击、充电尖峰等短时过流场景。
四、典型应用场景
- 开关电源输出整流与续流二极管
- USB/移动电源、充电器的保护与防反接
- 负载切换、电源反向保护电路
- 汽车电子和工业控制中对耐温要求较高的小功率整流
五、封装与热管理建议
SOD-323 为小功率表面贴装封装，散热能力有限。设计时建议：
- 在 PCB 上增加铜箔面积和散热过孔，改善结-壳-板热流路径；
- 若工作电流接近 2A 或长时间高频开关，请评估结温并留裕量，必要时采用并联或更大封装器件；
- 注意焊接温度曲线符合无铅回流规范，避免过热损伤器件。
六、使用与可靠性注意事项
- 在高反向偏压下（接近 40V）会出现较高反向漏流，应保证实际工作电压远低于 Vr 以减少漏电与热耗；
- 浪涌能力为短时规格，不可作为长期过流解决方案；
- 建议在关键线路增加适当的滤波与浪涌抑制元件以提升系统鲁棒性。
七、采购与替代
MS2A40LWS 适合对成本、体积和效率有综合要求的产品。选型时可与同类肖特基（如 SOD-323 封装、Vr≈40V、If≈2A 级别）器件比较 Vf、Ir 和 Ifsm 等参数。批量采购可联系 MSKSEMI 授权分销商获取样品和器件文档。
如需器件详细数据手册、典型应用电路图或热仿真建议，可提供具体工作条件（最大电流、占空比、环境温度、PCB 板厚）以便进一步匹配与优化。
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