Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MSTP4056H(2X2)是美森科(MSKSEMI) 针对便携电子设备推出的一款超小封装线性充电芯片,专为单节3.7V标称锂电池设计,核心优势在于“体积迷你化+低功耗+高兼容性”,适配主流USB 5V供电场景,可满足多数超薄便携产品的充电需求。
随着可穿戴设备、TWS耳机等产品向“轻薄化、小型化”演进,传统充电芯片因封装过大、静态功耗偏高难以适配。MSTP4056H(2X2)针对性优化了封装与功耗,采用DFN-8(2×2)封装(尺寸仅2mm×2mm,高度<0.8mm),同时将静态电流降至65uA,完美解决了低功耗便携设备的充电设计痛点。
供电与充电能力
输入工作电压为5V(与USB Type-C、Micro-USB等主流接口完全兼容),最大持续充电电流可达1A,可满足TWS充电盒(典型500mA-1A)、小型充电宝(10000mAh以下)等设备的快充需求。
双饱和电压适配
支持4.35V/4.2V双充电饱和电压,无需额外硬件切换:
低静态功耗
待机静态电流仅65uA,远低于传统4056系列芯片(通常100uA以上),可显著延长设备待机时间——例如TWS充电盒待机时,仅需极少量电流维持芯片工作,无需频繁补电。
电池温度检测
内置NTC温度检测接口,支持外接热敏电阻实时监测电池温度:当电池温度超过阈值(如45℃)时自动降低充电电流,温度过高时停止充电,避免过充过热引发安全隐患。
MSTP4056H(2X2)遵循锂电池标准充电流程,同时内置多重保护机制:
采用DFN-8(2×2)封装,相比传统SOT-23-5封装体积缩小60%,且散热性能更优:芯片底部散热焊盘可直接与PCB接地层连接,1A电流下线性充电产生的热量能快速散出,无需额外散热片,进一步简化产品设计。
MSTP4056H(2X2)因体积小、功耗低、兼容性强,广泛适用于:
综上,MSTP4056H(2X2)是一款“小而全”的单节锂电充电芯片,在超小体积下实现了高充电效率、低功耗与多重安全保护,是便携电子设备充电方案的高性价比选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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