WMSIC Electronic Components

MSKSEMI MSTP4056H(2X2) MSTP4056H

ModelMSTP4056H(2X2)
PackageDFN-8(2x2)
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI MSTP4056H(2X2)
Type
MSKSEMI
Minimum package
3000 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
MSTP4056H(2X2)
Electronic Component
1
Package
DFN-8(2x2)
Electronic Component
Battery Management
Electronic Component
0.038g
Electronic Component
1
Features
Programmable Current
Electronic Component
BM0264468917
Operating Voltage
5V
Battery Type
Battery
Battery
1
ICType
IC
Static Current(Iq)
65uA
and Voltage
4.35V;4.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MSTP4056H(2X2) 单节锂电池充电芯片产品概述

MSTP4056H(2X2)是美森科(MSKSEMI) 针对便携电子设备推出的一款超小封装线性充电芯片,专为单节3.7V标称锂电池设计,核心优势在于“体积迷你化+低功耗+高兼容性”,适配主流USB 5V供电场景,可满足多数超薄便携产品的充电需求。

一、核心定位与设计背景

随着可穿戴设备、TWS耳机等产品向“轻薄化、小型化”演进,传统充电芯片因封装过大、静态功耗偏高难以适配。MSTP4056H(2X2)针对性优化了封装与功耗,采用DFN-8(2×2)封装(尺寸仅2mm×2mm,高度<0.8mm),同时将静态电流降至65uA,完美解决了低功耗便携设备的充电设计痛点。

二、关键电气参数亮点

  1. 供电与充电能力
    输入工作电压为5V(与USB Type-C、Micro-USB等主流接口完全兼容),最大持续充电电流可达1A,可满足TWS充电盒(典型500mA-1A)、小型充电宝(10000mAh以下)等设备的快充需求。

  2. 双饱和电压适配
    支持4.35V/4.2V双充电饱和电压,无需额外硬件切换:

    • 4.35V适配高容量单节锂电(如部分智能手机内置电池、高容量TWS电池);
    • 4.2V适配常规单节锂电(如智能手环、普通蓝牙耳机电池),覆盖90%以上单节锂电类型。
  3. 低静态功耗
    待机静态电流仅65uA,远低于传统4056系列芯片(通常100uA以上),可显著延长设备待机时间——例如TWS充电盒待机时,仅需极少量电流维持芯片工作,无需频繁补电。

  4. 电池温度检测
    内置NTC温度检测接口,支持外接热敏电阻实时监测电池温度:当电池温度超过阈值(如45℃)时自动降低充电电流,温度过高时停止充电,避免过充过热引发安全隐患。

三、功能特性与安全保障

MSTP4056H(2X2)遵循锂电池标准充电流程,同时内置多重保护机制:

  • 三阶段充电:预充(电池<3V时,以10%额定电流充电)→恒流(CC,1A最大)→恒压(CV,4.2V/4.35V饱和),确保电池安全充满;
  • 过充保护:达到饱和电压后自动切换至涓流充电(或关断),防止电池过充;
  • 过流保护:充电电流超1A时自动限流,避免芯片或电池损坏;
  • 欠压保护:输入电压低于4.5V时停止充电,防止电源不足导致异常。

四、封装与散热优势

采用DFN-8(2×2)封装,相比传统SOT-23-5封装体积缩小60%,且散热性能更优:芯片底部散热焊盘可直接与PCB接地层连接,1A电流下线性充电产生的热量能快速散出,无需额外散热片,进一步简化产品设计。

五、典型应用场景

MSTP4056H(2X2)因体积小、功耗低、兼容性强,广泛适用于:

  1. 便携音频:TWS蓝牙耳机充电盒、无线耳机、蓝牙音箱;
  2. 可穿戴设备:智能手环、智能手表、运动心率带;
  3. 小型电子配件:便携式充电宝(10000mAh以下)、5W小功率无线充电器;
  4. 物联网终端:低功耗传感器节点、智能门锁(备用电池充电)、儿童定位器。

综上,MSTP4056H(2X2)是一款“小而全”的单节锂电充电芯片,在超小体积下实现了高充电效率、低功耗与多重安全保护,是便携电子设备充电方案的高性价比选择。

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