WMSIC Electronic Components

MSKSEMI OPA348AIDBVR-MS OPA348AIDBVR

ModelOPA348AIDBVR-MS
PackageSOT23-5
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI OPA348AIDBVR-MS
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
OPA348AIDBVR-MS
Electronic Component
1
Package
SOT23-5
Electronic Component
Operational Amplifier
Electronic Component
0.04g
Electronic Component
1
Electronic Component
Output
Features
Built-in
Electronic Component
BM0230096620
Operating Temperature
40℃~+125℃
Amplifier
1
(SR)
1.2V/us
Power Supply Voltage
2.1V~5.5V
Static Current(Iq)
28uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

OPA348AIDBVR-MS 产品概述

一、产品简介

OPA348AIDBVR-MS(品牌:MSKSEMI/美森科)为单路低功耗、轨到轨输入/输出运算放大器,封装为SOT23-5。器件在宽电源电压范围内工作,提供高共模抑制、极低偏置电流与较小的输入失调,适合便携与工业级信号调理应用。

二、主要规格亮点

  • 放大器数:单路
  • 电源宽度(Vdd–Vss)最大:5.5 V;单电源工作:2.1 V~5.5 V;双电源:Vee~Vcc = -1.35 V~2.75 V
  • 轨到轨输入与输出,便于在低电压系统直接驱动ADC与后级电路
  • 增益带宽积(GBP):1.5 MHz
  • 压摆率(SR):1.2 V/µs
  • 输入失调电压(Vos):3 mV,温漂(Vos TC):650 nV/℃
  • 输入偏置电流(Ib):2 pA,输入失调电流(Ios):1 pA,适合高阻传感器接口
  • 共模抑制比(CMRR):95 dB
  • 静态电流(Iq):28 µA(低功耗特性)
  • 工作温度范围:-40 ℃~+125 ℃(工业级)

三、典型应用场景

  • 便携式与电池供电设备的缓冲与低频放大
  • 传感器信号调理(高阻传感器、电容式/电压型传感器)
  • ADC 前端缓冲、采样保持驱动、低速滤波器
  • 工业控制与数据采集系统,需宽温域与低功耗场合

四、设计与使用要点

  • 电源去耦:建议在靠近器件的电源引脚并行放置0.01–0.1 μF陶瓷电容与1 μF的钽/陶瓷电容以保证稳定性与瞬态响应。
  • 增益与稳定性:GBP 1.5 MHz 与 1.2 V/μs 的压摆率适合低至中等增益(如增益1~100)应用,若用于较高带宽要求,应评估相位裕度与闭环响应。
  • 高阻源驱动:输入偏置仅几皮安,适于直接连接高阻传感器,但应注意漂移与泄漏路径(印制板表面清洁、避免潮湿);输入保护在存在过压或静电风险时应配置限流或夹位器件。
  • 输出驱动能力:轨到轨输出在接近电源轨时仍有有限摆幅余量;若需驱动较大负载电流或低阻负载,需确认输出摆幅与功耗要求。
  • 温度影响:Vos 温漂为 650 nV/℃,在高精度温漂敏感应用中有良好表现,但系统级偏差仍需通过校准或差分测量进一步抑制。

五、封装与采购信息

  • 封装:SOT23-5,适合空间受限的便携与紧凑板设计。
  • 品牌:MSKSEMI(美森科)。型号:OPA348AIDBVR-MS。用于工业温度范围,适合批量生产与嵌入式系统选型。

六、总结建议

OPA348AIDBVR-MS 以其低静态电流、轨到轨特性、极低输入偏置电流与工业级温度范围,适用于电池供电与高阻传感器接口的低频精密放大任务。设计时注意电源去耦、PCB 漏电控制与负载要求评估,可在多数便携和工业信号调理场合获得稳定可靠的性能表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.