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MSKSEMI BAT46X
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI BAT46X
- Type
- MSKSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- BAT46X
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.26g
- Electronic Component
- 1
- Electronic Component
- BM0265972330
- Current
- 150mA
- Diode
- Electronic Component
- Current(Ir)
- 2uA@75V
- (Vf)
- 1V@250mA
- Electronic Component
- 40℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAT46X 产品概述
一、产品简介
BAT46X 是由 MSKSEMI（美森科）提供的一款独立式小信号二极管，采用 SOD-523 超小表贴封装。该器件面向低功耗、高密度的电子线路，适用于开关、整流、检波与极性保护等场合。器件工作结温范围为 -40℃ 至 +125℃，可在工业温度域内稳定工作。
二、主要电气参数
- 直流反向耐压 Vr: 100 V（最大）
- 正向压降 Vf: 1.0 V @ 250 mA（标称条件）
- 整流电流（最大）：150 mA（连续）
- 非重复峰值浪涌电流 Ifsm: 750 mA（单次浪涌能力）
- 反向电流 Ir: 2 μA @ 75 V（典型/测试条件）
以上参数描述了器件在小电流到中等脉冲电流条件下的性能边界。需要注意连续工况下的平均功耗与封装散热限制。
三、性能特点
- 小封装：SOD-523 占板面积小，适合高密度贴片设计。
- 宽工作温度：-40℃ 至 +125℃，适用工业级温度要求。
- 低反向漏电：在高达 75 V 时反向电流仅约 2 μA，适合高压小信号应用。
- 良好浪涌能力：750 mA 的非重复峰值浪涌电流，可承受瞬态脉冲保护需求。
- 适度正向压降：1 V @ 250 mA，需在设计中考虑功耗与电压降影响。
四、常见应用场景
- 低功率整流与检波：用于小电流的半波整流或信号检波电路。
- 极性/反接保护：对低电流接口提供反接保护或输入整流。
- 开关/钳位电路：作为高频开关或钳位元件，处理短时浪涌。
- 仪表与传感器前端：在要求低漏电与小体积的传感器电路中应用。
五、封装与布局建议
SOD-523 为极小型贴片封装，热容小、散热能力有限。设计时建议：
- 在 PCB 上为二极管引脚提供较大铜箔或热铜面以提高散热。
- 对于持续接近额定整流电流（150 mA）的应用，应增加铜箔面积或使用热通孔。
- 考虑正向压降导致的功耗：P ≈ I × Vf（例如 150 mA × 1.0 V = 0.15 W），并按环境温度做降额设计。
- 注意焊接工艺，避免过热影响结温；遵循制造商的回流温度曲线。
六、选型与使用注意
- 若电路常态电流接近或超过 150 mA，建议选用额定电流更高的封装或器件。
- 浪涌能力 750 mA 为非重复峰值，适用于短时脉冲；连续或高频脉冲应谨慎评估。
- 反向漏电随温度上升会增加，在高温环境下注意漏电对电路的影响（偏置、功耗等）。
- 在高频或高速开关场合，关注结电容、恢复特性等参数（详见完整数据手册）。
总结：BAT46X（MSKSEMI，SOD-523）是一款体积小、耐压高且适合低至中等电流应用的独立式二极管，适用于紧凑型电路板上的整流、保护与开关用途。选用时需综合考虑连续电流、封装散热和工作温度对性能的影响，必要时参考完整数据手册以获取更详细的温度、电容与时序参数。
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