Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
MSKSEMI BZT52C3V3S
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- MSKSEMI BZT52C3V3S
- Type
- MSKSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MSKSEMI
- Electronic Component
- BZT52C3V3S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 95Ω
- Electronic Component
- BM0220158383
- Diode
- 1
- Current(Ir)
- 5uA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 3.1V~3.5V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BZT52C3V3S
一、基本信息
BZT52C3V3S 是一款来自 MSKSEMI（美森科）的集成电路元器件，封装形式为 SOD-323。这种元器件广泛应用于各种电路中，尤其是用于稳压和去耦应用中。BZT52C3V3S 被设计为一个稳压二极管，主要用于提供稳恒的电压输出，以确保电路中其他组件的正常工作。
二、封装类型
SOD-323 封装是一种小型的表面贴装器件，具有较低的引脚间距和高度，适合高密度的印刷电路板(PCB)设计。其尺寸小，适合用于移动设备、小型家电及其他对空间有限制的电子产品中。SOD-323 封装还具有较好的散热性能，能够应对一定程度的功率负荷。
三、技术参数
标称稳压值：BZT52C3V3S 提供的稳压值为 3.3V，这一电压值在许多电子方案中非常常见，特别是在低电压操作的数字和模拟电路中。
最大反向击穿电压：该产品在反向偏置条件下能够承受高达 5V 的电压，这保证了其在多数操作条件下的稳定性。
功率耗散：BZT52C3V3S 的额定功率通常为 500mW，这使其能够在一定负载条件下稳定工作而不产生过多的热量。
引脚配置：封装中的引脚排列合理，便于使用自动化设备进行焊接。对于设计师来说，这种封装简化了装配流程，提高了生产效率。
四、应用场景
BZT52C3V3S 主要用于以下几种应用：
电源稳压：它能够提供稳定的直流电压输出，使得供电系统更加可靠，适合用于微控制器、传感器和其他数字电路的电源供应。
过压保护：在电路中用作过压保护元件，当电压超出安全范围时，BZT52C3V3S 会导通，从而保护后级电路不受到损害。
去耦电路：在电源供应线路中，通常需要使用稳压二极管进行去耦，以减少电压波动对敏感电路的影响。BZT52C3V3S 在这一领域表现优秀。
音频设备：在音频设备中，稳压二极管可以保持放大器的工作电压稳定，确保音频信号的纯净度。
五、优点
- 稳定性高：BZT52C3V3S 提供的电压极为稳定，适合于对电压要求高的应用场合。
- 小型化设计：SOD-323 封装的设计使得其可以在紧凑型电子产品中广泛应用。
- 性能优越：在多种温度和电压条件下仍能保持良好的性能特征。
- 易于集成：其小巧的体型和灵活的应用使得设计人员能够轻松集成到不同的电路设计中。
六、结论
综上所述，BZT52C3V3S 作为一款稳压二极管，凭借其精确的稳压能力、高度的可靠性以及适合密集集成的 SOD-323 封装，成为现代电子设计中不可或缺的元件。无论是在消费电子、工业设备，还是在通信相关产品中，都能够找到其身影，是一种高性能的解决方案选型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
