WMSIC Electronic Components

MSKSEMI SMF26CA

ModelSMF26CA
PackageSOD-123FL
BrandMSKSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
MSKSEMI SMF26CA
Type
MSKSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MSKSEMI
Electronic Component
SMF26CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.04g
Electronic Component
1
Electronic Component
BM0227539834
Voltage
42.1V
Current(Ir)
1uA
Voltage(VBR)
28.9V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF26CA 产品概述

一、产品简介

SMF26CA 为 MSKSEMI(美森科)出品的一款双向瞬态电压抑制器(TVS),封装为 SOD-123FL,定位于中等能量的浪涌与瞬态抑制。该器件旨在保护敏感电子电路免受静电放电(ESD)、雷击感应脉冲以及开关瞬态等过电压冲击,常用于通信接口、汽车电子、工业控制及消费类电子的电源和信号线上。

二、主要技术参数

  • 类型:TVS(瞬态电压抑制二极管)
  • 极性:双向(Bidirectional)
  • 反向截止电压 Vrwm:26 V(最大连续工作电压)
  • 击穿电压(典型或测试值):28.9 V
  • 钳位电压(在峰值脉冲电流下):42.1 V
  • 峰值脉冲功率 Ppp:200 W
  • 峰值脉冲电流 Ipp:4.8 A
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下)
  • 封装:SOD-123FL(低剖面表面贴装)

以上参数来自器件规格信息,用于评价抑制能力与在系统中允许的工作范围。

三、功能与优势

  • 双向保护:适用于交流或双向脉冲场景,无需额外方向选择电路,方便保护信号线或对称电源线。
  • 有效抑制大能量冲击:200 W 的峰值脉冲功率和 4.8 A 的峰值脉冲电流使其能处理中等强度的瞬态浪涌,钳位电压 42.1 V 能将瞬态电压钳制在可接受范围内,减小下游器件承受的应力。
  • 低漏电流:在 26 V 工作电压下,反向漏电流仅约 1 μA,有利于低功耗系统和对泄漏敏感的应用。
  • 小型低剖面封装:SOD-123FL 便于在空间受限的板上布置,适合表面贴装工艺并兼顾散热与安装强度。

四、典型应用场景

  • 通信接口保护:如串口、USB 接口、差分信号线的过电压防护。
  • 汽车电子:用于车载控制单元的局部保护(注意汽车级温度及可靠性要求需与供应商确认)。
  • 工业控制与传感器接口:保护输入/输出端口免受感应雷击或开关瞬态影响。
  • 电源输入保护:用于开关电源初级或次级的浪涌抑制,保护后级敏感器件。

五、封装与安装注意事项

  • 封装为 SOD-123FL,采用标准表面贴装流程。建议将 TVS 器件尽量靠近需要保护的接口或连接点放置,以缩短 PCB 上的走线并降低感应电压。
  • 热管理:尽管为瞬态器件,但在频繁冲击或高能量场景下 PCB 的散热路径设计(铜箔面积)会影响器件的重复冲击能力与可靠性。
  • 焊接工艺:兼容常规回流焊流程,但请参考厂家提供的焊接规范以避免过热导致元件性能退化。
  • 防静电与储存:器件为半导体风格,装配与测试时应遵循 ESD 防护标准,存储避免潮湿并按包装标识处理。

六、选型与替代建议

在选择 SMF26CA 时,请确认系统的最大连续工作电压小于或等于 Vrwm(26 V),并保证最大可能的浪涌电流不超过 Ipp(4.8 A)或器件的能量吸收能力。若系统存在更高的冲击能量或需更低钳位电压,可考虑更大功率等级或不同工作电压点的 TVS 器件。对于单向电源线保护,可改用对应单向型号以获得更低的钳位电压。

七、可靠性与测试建议

  • 在量产前建议做实际系统级的冲击/浪涌测试(在目标 PCB 与连接结构下),以验证钳位电压和重复耐受性。
  • 对于关键应用(如车规或工业级),建议与供货方确认器件的温度范围、寿命以及是否通过相关认证(例如 AEC-Q101)以满足项目可靠性要求。

结语:SMF26CA 为一款在中等能量脉冲条件下表现均衡的双向 TVS 器件,结合低漏电、紧凑封装与 200 W 峰值脉冲能力,适用于多种接口与电源防护场景。选型时请以系统的最大工作电压、预期冲击能量和环境条件为准,并参考厂方完整数据手册以获取更详尽的电气与机械参数。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.